Chief Manufacturing Officer (Semiconductors)

Nexoval Group; Texas; On-site; USD 260,000 - 340,000; Full time

Benefits offered by this job

Performance bonus

Equity incentive

Medical coverage

401(k) with match

Executive time off

Relocation assistance

Job summary

Nexoval Group is seeking a Chief Manufacturing Officer for its semiconductor operations in the United States. You will lead global manufacturing, including fab, assembly, test and packaging, and manage external partners to meet growth, margin and quality targets.

You will drive advanced manufacturing, capital strategy and supply chain resilience, partnering with Engineering, R&D and Finance to align cost, roadmap and commitments. Extensive travel may be required.

Qualifications

• Executive leadership and people-management capabilities.
• Strong strategic thinking with capability to align manufacturing to corporate roadmap.
• Excellent stakeholder management across global partners and customers.
• Deep experience in high-volume semiconductor operations and supply chain.
• P&L ownership with ability to drive margin and efficiency.

Responsibilities

• Define and execute global manufacturing strategy aligned with product roadmaps.
• Lead fab, assembly, test and packaging operations, including outsourced partners.
• Drive yield, cycle-time and cost-per-wafer improvements via data analytics.
• Oversee capacity planning, capital expenditure and fab expansion initiatives.
• Transfer new processes from R&D to high-volume manufacturing.
• Build and manage relationships with foundries, OSATs, suppliers and customers.
• Strengthen supply chain resilience and manage geopolitical/regulatory considerations.
• Champion quality, reliability, and ISO/IATF compliance as applicable.
• Drive adoption of smart manufacturing and AI-driven optimization.
• Support government incentives like CHIPS Act when relevant.
• Lead an executive manufacturing team and engage with board and investors.

Job description

Chief Manufacturing Officer (Semiconductors)

Dallas, United States | Posted on 10/14/2026

Key Responsibilities

• Define and execute the company’s global manufacturing strategy, aligned with long-term business, technology and product roadmaps.
• Provide executive leadership across fab, assembly, test and packaging operations, both in-house and through outsourced partners such as foundries and OSATs.
• Drive yield improvement, cycle-time reduction and cost-per-wafer performance through data-driven process control and continuous improvement.
• Lead capacity planning and capital expenditure strategy, including fab expansions, tool investments and greenfield or brownfield projects.
• Oversee the transfer of new process technologies and products from R&D into high-volume manufacturing.
• Build and manage strategic relationships with foundries, equipment vendors, materials suppliers and key customers.
• Strengthen supply chain resilience, including dual-sourcing, risk mitigation and geopolitical and regulatory considerations.
• Ensure the highest standards of quality, reliability and compliance, including ISO 9001, IATF 16949 (where applicable) and customer-specific requirements.
• Champion environmental, health and safety performance and sustainability initiatives across all manufacturing sites.
• Own the manufacturing P&L and operating budget, delivering against margin, output and efficiency targets.
• Partner with Engineering, R&D, Finance and Commercial teams on product cost, roadmap planning and customer commitments.
• Lead the adoption of smart manufacturing, automation, advanced analytics and AI-driven process optimization.
• Support government funding and incentive programs, such as CHIPS Act initiatives, where relevant.
• Build, lead and develop a high-performing, global manufacturing leadership team, and plan for succession.
• Represent manufacturing at board level and with investors, customers and industry bodies.

Requirements

• Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field. A Master's, PhD or MBA is strongly preferred.
• 15+ years of semiconductor manufacturing experience, including at least 7 years in senior executive operations leadership.
• Proven track record of leading high-volume wafer fab and/or back-end (assembly, test and packaging) operations.
• Deep expertise in semiconductor process technology, yield management and statistical process control.
• Demonstrated success in scaling capacity, ramping new technologies and managing large capital programs.
• Strong experience managing foundry and OSAT partnerships and complex global supply chains.
• P&L ownership and experience reporting to a CEO and/or board of directors.
• Exceptional leadership, strategic thinking and stakeholder management skills.
• Willingness to travel domestically and internationally as required.

Benefits and Compensation

Our client offers a competitive base salary of $260,000 - $340,000 per annum, depending on experience. The package also includes a significant annual performance bonus, a long-term equity incentive, comprehensive medical, dental and vision coverage, a 401(k) with company match, executive paid time off and relocation assistance.