Chief Engineer & Scientist, Space Imaging R&D Leader

L3Harris Technologies, Inc.; City of Rochester (NY); Presencial; USD 133.000 - 247.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Relocation assistance

Health and disability insurance

401(k) match

Paid time off

Descripción de la vacante

L3Harris Technologies is seeking a Chief Engineer/Innovation Chief Engineer for Space Superiority and Imaging. The role focuses on R&D for electro-optical payloads, subsystems, and software across national, civil, and commercial space programs in Rochester, NY.

Responsibilities include leading optical/electrical/mechanical assemblies, aligning 기술 roadmaps, and driving innovation in segmented optics and on-board processing.

Formación

• Bachelor’s degree in engineering, science, or similar technical field; Graduate Degree preferred.
• Active TS/SCI security clearance is required.
• Minimum 12 years of relevant experience; 10 years with graduate degree; 16 years if no degree.

Responsabilidades

• Provide leadership on optical, electrical, and mechanical assemblies; drive roadmaps and architectures.
• Develop and execute R&D plans aligned with technology roadmaps; identify differentiators.
• Mentor lower-level engineers to grow SMEs and manage current R&D projects.
• Interface with universities and industrial partners for collaboration on development.
• Identify emerging technologies and drive technology roadmaps across the division.

Conocimientos

Functional management experience

EO/IR space payloads experience

Active TS/SCI security clearance

Educación

Bachelor’s degree in engineering, science, or similar technical field

Graduate degree (Master/PhD)

Descripción del empleo

L3Harris Technologies is seeking a Chief Engineer/Innovation Chief Engineer for Space Superiority and Imaging. The role focuses on R&D for electro-optical payloads, subsystems, and software across national, civil, and commercial space programs in Rochester, NY.

Responsibilities include leading optical/electrical/mechanical assemblies, aligning 기술 roadmaps, and driving innovation in segmented optics and on-board processing.