Advanced Packaging Interposer Integration Engineer

SkyWater Technology; Kissimmee (FL); On-site; USD 159,000 - 238,000; Full time

Benefits offered by this job

401k match

Life insurance

SkyWater stock purchase

Job summary

SkyWater Technology in Florida seeks a Senior Advanced Packaging Si Interposer Process Integration and Development Engineer to lead and optimize an integrated packaging flow for client projects. You will collaborate with foundry teams to deliver qualified products with high yield and on-time delivery.

The role requires deep experience in Si interposer, FanOut and hybrid bonding processes, plus strong communication skills to interface with customers, colleagues, and management.

Qualifications

• 10+ years of Process Development & Integration experience in Advanced Packaging Fab.
• Advanced Packaging Fab processing tools knowledge/experience.
• MEMS / Photonics / HPC / AI / ASIC / Quantum device integration knowledge.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

Responsibilities

• Translate a client’s package requests into a process flow that utilizes Si interposer, FanOut and hybrid bonding manufacturing.
• Lead the process team to deliver on schedule and with high yield a qualifiable final product.
• When required, lead task forces to identify root causes, correct and maintain product deliverables.
• Gain/utilize knowledge of tool capabilities to create recipes for bonding and deposition steps.
• Process integration for MEMS/Photonic/HPC/AI/ASIC/Quantum devices.
• Integrate TSV front side and TSV back side flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions and document results.
• Monitor SPC charts for trends and drive integration changes.
• Create end-to-end process flows to aid in project scoping.

Skills

Si interposer & bonding

Process development & integration

DOE / SPC / Six Sigma

Data analysis

Project management

Cross-functional teamwork

Education

BS Engineering

MS/PhD preferred

Tools

Process equipment knowledge

Job description

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world.

Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

We are looking for a hardworking, and passionate experienced Sr. Advanced Packaging Si Interposer Process Integration and Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Responsibilities:

Transfer a client's package requests into a process flow that utilizes Si interposer, FanOut and hybrid bonding manufacturing process flows. Identify areas that require development and lead the process team to deliver on schedule and with high yield a qualifiable final product. When required, lead task forces to identify root causes, correct and maintain product deliverables.

• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools.
• Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices.
• Integrate TSV front side and TSV back side process flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Utilize data analysis software to drive data driven decisions
• Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
• Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package.
• Create end-to-end process flows to aid in project scoping
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS Engineering, MS/PhD preferred

• 10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environment of 10K and 1K clean rooms related to Si Interposer and Bonding.
• Advanced Packaging Fab processing tools knowledge/experience
• MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

The annual salary range for this role is $158,960 - $238,440. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.

SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.

Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.

SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or [e-mail].

EOE, including disability/vets

We will never ask applicants to pay fees, purchase equipment or gift cards, or provide financial information before a formal offer of employment has been accepted. If you receive a suspicious communication claiming to represent our company, please verify its authenticity by contacting our recruitment team at [e-mail] before responding.