Advanced Packaging Engineer

Samtec, Inc.; Santa Clara (CA); On-site; USD 220,000 - 250,000; Full time

Benefits offered by this job

Medical (HSA/PPO)

Dental

Vision

Hearing

401(k) match / profit sharing

Paid time off

Job summary

Samtec, Inc. is seeking an experienced Advanced Packaging Engineer to focus on next-generation optical and optoelectronic technologies. Responsibilities include defining advanced packaging architectures and leading early-stage technology development.

The ideal candidate should have 15+ years of experience in relevant development fields and a strong educational background. This role offers competitive salaries based on experience with generous bonuses and extensive benefits.

Qualifications

• 15+ years of experience in optical, optoelectronic, or advanced microelectronics development.
• Extensive background in materials, packaging architectures, and advanced process development.

Responsibilities

• Define and develop next-generation optical and optoelectronic packaging architectures.
• Lead architectural trade studies considering optical performance, materials behavior, and future scalability.
• Analyze optical, mechanical, and thermal data to inform design decisions.

Skills

Optical and optoelectronic technologies

Advanced materials and packaging architectures

Technical leadership

Independent problem solving

Education

BS in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a related field

MS or Ph.D. preferred

Job description

Samtec, Inc.

Position Title

Advanced Packaging Engineer

Position Summary

The Advanced Packaging Engineer is a senior individual contributor responsible for conceiving, architecting, and maturing next‑generation optical and optoelectronic technologies. This role focuses on future‑state capability creation, advanced materials and packaging architectures, and long‑term technology differentiation. The position operates upstream of production and is not responsible for sustaining engineering or day‑to‑day manufacturing support.

Essential Duties and Responsibilities

Advanced Technology & Architecture Development

• Define and develop next‑generation optical and optoelectronic packaging architectures.
• Lead architectural trade studies considering optical performance, materials behavior, and future scalability.
• Establish technology concepts that enable future product families and platforms.

Research & Early‑Stage Development

• Research emerging materials, processes, and assembly technologies aligned with long‑term company roadmaps.
• Lead feasibility studies, proof‑of‑concept efforts, and early‑stage demonstrations.
• Evaluate technology readiness levels and define pathways for maturation.

Characterization & Reliability Strategy

• Define characterization and reliability evaluation methodologies for early‑stage technologies.
• Analyze optical, mechanical, and thermal data to inform design decisions.
• Identify technical risks and failure mechanisms early in development.

Technology Strategy & Roadmapping

• Contribute to long‑term optics and optoelectronics technology roadmaps.
• Identify capability gaps and propose strategic development initiatives.
• Support senior leadership through technical reviews and risk assessments.

External Collaboration

• Identify, evaluate, and partner with material suppliers, equipment vendors, and research institutions.
• Lead joint development initiatives with external partners.
• Influence external technology roadmaps to align with future needs.

Technical Leadership

• Serve as a recognized technical authority for advanced optical technologies.
• Contribute to intellectual property, publications, and technical knowledge growth.
• Mentor engineers on advanced technology concepts.

Required Education

• BS in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a related field required.
• MS or Ph.D. preferred.

Required Experience

• 15+ years of experience in optical, optoelectronic, or advanced microelectronics development.
• Extensive background in materials, packaging architectures, and advanced process development.
• Demonstrated experience creating and maturing new technologies from concept through early validation.
• Proven record of technical leadership and independent problem solving.

Salary and Benefits

Preferred location: Samtec Vista Design Center, San Diego/Vista, CA. Salary range is $187,000 – $212,000 annually, based on experience, plus generous Samtec bonuses paid three times per year.

Secondary option: Silicon Valley Design Center, Santa Clara, CA. Salary range is $220,000 – $250,000 annually, based on experience, plus the same bonus structure.

Third location: Samtec Microelectronics facility, Colorado Springs, CO. Salary range is $159,000 – $180,000 annually, based on experience, plus bonuses as noted above.

Relocation assistance is available only for moves to the preferred location (San Diego/Vista, CA).

Samtec's generous benefits package includes medical (HSA/PPO), dental, vision, hearing, group life, AD&D, short‑ and long‑term disability, EAP, 401(k) match / profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.

Equal Employment Opportunity

SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.

Equal employment opportunity, including veterans and individuals with disabilities.

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