Additive Manufacturing Engineering Intern – Hands-On

Moog

East Aurora (NY)

On-site

USD 35,000 - 43,000

Full time

6 days ago
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Benefits offered by this job

Relocation assistance

Job summary

Moog seeks an Intern in Additive Manufacturing Engineering to contribute to key engineering tasks and support engineers in Buffalo, NY. The role requires enrollment in Mechanical/Aerospace Engineering with a GPA of 3.0+ and willingness to relocate for the internship, with access to export-controlled information as applicable.

The internship emphasizes hands-on experience, data collection and analysis, material evaluation, and potential 3-D printing tasks within a collaborative, inclusive Moog

Qualifications

  • Enrolled in Mechanical Engineering, Aerospace Engineering, or related field at accredited university.
  • GPA at least 3.0.
  • Access to U.S. export-controlled information.
  • Ability to relocate for the duration of the internship.
  • Professional disposition and strong communication within a team environment.

Responsibilities

  • Contribute to preparation and execution of key engineering tasks.
  • Provide technical support to engineers as needed.
  • Collect, manage, and analyze data; evaluate material properties; product and project engineering; operate a 3-D printer as applicable.
  • Provide input on project processes, strategies, and execution.
  • Represent Moog in a professional manner.

Skills

Communication skills
Teamwork

Education

Mechanical or Aerospace Engineering (Bachelor's/Master's)

Job description

Moog seeks an Intern in Additive Manufacturing Engineering to contribute to key engineering tasks and support engineers in Buffalo, NY. The role requires enrollment in Mechanical/Aerospace Engineering with a GPA of 3.0+ and willingness to relocate for the internship, with access to export-controlled information as applicable.

The internship emphasizes hands-on experience, data collection and analysis, material evaluation, and potential 3-D printing tasks within a collaborative, inclusive Moog

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