2027 Undergrad ASIC Package Engineering Co-op/Intern

AMD; Boxborough (MA); Hybrid; USD 27,552,000 - 41,328,000; Full time

Job summary

AMD is seeking a motivated ASIC Package Engineering intern/co-op to join our team in a hands-on role. You will support package design and development activities, help train on substrate, interposer, and bump designs, and work on design verification to ensure performance and yield.

You will gain real-world experience in a collaborative environment with access to AI and advanced packaging innovations, while studying a relevant engineering discipline.

Qualifications

• Pursuing a US-based Bachelor's degree in an engineering field with relevant coursework.
• Familiarity with transmission lines and electric circuits is preferred.
• Experience with design software for packaging, silicon, or PCB layouts is a plus.
• Knowledge of scripting languages (Perl, Python, SQL) is desirable.
• Understanding of semiconductor theory and packaging processes is beneficial.
• Data analytics and data visualization skills, especially PowerBI, are a plus.

Responsibilities

• Support ASIC package design and development engineers on projects.
• Assist with substrate, interposer, and bump designs for products and test vehicles.
• Contribute to design verification to ensure performance and quality.
• Analyze yield and defect metrics to improve design yield.
• Evaluate packaging materials and work with partners for cost-efficient designs.

Skills

Transmission lines knowledge

Electric circuits

Scripting languages

Semiconductor theory

Packaging process/tech

Data analytics

Education

Bachelors in Electrical Engineering or related field

Tools

Package/silicon/PCB design software

PowerBI

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next‑gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

As an AMD intern or co‑op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real‑world experience on projects that impact millions of end‑users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

Job Details

• Location: Austin, TX or Boxborough, MA; summer only: Fishkill, NY; Fort Collins, CO; Longmont, CO; or Secaucus, NJ
• Onsite/Hybrid: This role requires the student to work full time (40 hours a week), in either a hybrid or onsite work structure throughout the duration of the co‑op/intern term
• Duration:
• Spring/Summer Co‑op: January 25, 2027 – August 13, 2027
• Summer Internship:
• Semester Schools: May 24, 2027 - August 13, 2027
• Quarter Schools: June 21, 2027 – September 10, 2027
• Summer‑Fall Co‑op:
• Semester Schools: May 24, 2027 – December 10, 2027
• Quarter Schools: June 21, 2027 – December 10, 2027

What You Will Be Doing

We are seeking a highly motivated ASIC Package Engineering intern/co‑op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role –

• We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects
• We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
• We will assign you projects related to design verification implementation to ensure design performance, quality and efficiency
• Analyzing yield and defect metrics to ensure design performance and help improve the yield will be part of your responsibilities
• We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost‑efficient design and materials for the best performance and yield requirements

Who We Are Looking For

• You are currently enrolled in a US based University in a Bachelors degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
• If you have knowledge or experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply –
• Course related to transmission lines and electric circuits
• Package, silicon or PCB design software
• Scripting languages – Perl / Python / SQL
• Semiconductor theory and packaging process/technology.
• Data analytics and data visualization tools like powerBI

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.