Wet Etch Process Engineer

ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading technology company in Singapore is seeking an experienced Process Development Engineer to develop and optimize wet etching processes for substrate layers. The ideal candidate will have a PhD or Master’s degree and 5-10+ years of hands-on experience in semiconductor etching. The role involves collaboration with cross-functional teams and a strong focus on quality control and defect resolution. Competitive salary and opportunities for professional growth are offered.

Qualifications

• 5–10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.
• Familiar with substrate materials such as ABF, PID, PI, or photoresists.
• Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

Responsibilities

• Develop and optimize wet etching processes for substrate layers.
• Design experiments to evaluate and improve critical etch parameters.
• Define equipment requirements and manage tool qualifications.
• Identify and resolve etching-related defects.
• Collaborate with upstream/downstream processes to improve overall line yield.

Skills

Process characterization tools (SEM, AFM, XPS, optical profilers)

Problem-solving

Documentation

Communication

Education

PhD or Master’s degree in Chemical Engineering, Materials Science, Microelectronics, or related field

Tools

Process characterization tools

Job description

Job Responsibilities

Process Development & Optimization

• Develop and optimize wet etching processes for substrate layers.
• Design experiments (DOE) to evaluate and improve critical etch parameters (e.g., etch rate, uniformity).
• Establish and maintain robust process windows for R&D and volume production.

Equipment & Materials Management

• Define equipment requirements and manage tool qualifications (e.g., acid/ultrasonic cleaning, wet benches).
• Monitor and maintain etching tool performance, chemistry concentration, and bath lifetime.
• Evaluate and select etchants, and chemistry blends suitable for advanced substrates.

Yield, Quality & Defect Control

• Identify and resolve etching-related defects such as over-etch, or residues.
• Analyze root causes of defects using SEM, optical inspection, and profilometry tools.
• Collaborate with upstream/downstream processes to improve overall line yield and substrate performance.

Cross-Functional Collaboration

• Work closely with plating, lithography, CMP, and lamination teams to ensure seamless process integration.
• Support new product introductions (NPI) and customer qualifications with process stability and repeatability.

Documentation & Compliance

• Create and maintain technical documentation such as process specifications, control plans, FMEAs, and work instructions.
• Ensure processes comply with environmental, safety, and chemical handling regulations.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

• PhD or Master’s degree in Chemical Engineering, Materials Science, Microelectronics, or related field.
• 5–10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.
• Familiar with substrate materials such as ABF, PID, PI, or photoresists.
• Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

Specialized Knowledge & Skills:

• Knowledge of Damascene/SAP processes for high-density substrates.
• Proficiency with process characterization tools (SEM, AFM, XPS, optical profilers).
• Familiar with SPC, Six Sigma, and yield enhancement methodologies.
• Strong problem-solving, documentation, and communication skills.