URGENT: Application Engineer (Die sort/Die bond/Process)

TRUST RECRUIT PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading recruitment firm in Singapore is seeking an Application Engineer to provide technical support in semiconductor processes. This role requires a bachelor's degree in Mechanical Engineering and 3-5 years of relevant experience. Responsibilities include troubleshooting processes, collaborating with production teams, and conducting failure analysis. Competitive compensation and growth opportunities are provided.

Qualifications

• 3-5 years of experience in application or process engineering, preferably in semiconductor industry.
• Familiarity with relevant industry standards and quality management systems.

Responsibilities

• Provide technical support and troubleshoot issues related to manufacturing processes.
• Collaborate with production teams to optimize processes and improve product quality.
• Conduct failure analysis and develop corrective actions.

Skills

Problem-solving and analytical skills

Communication and interpersonal skills

Proficiency in die sort and die bond processes

Education

Bachelor's degree in Mechanical Engineering or related discipline

Job description

What you'll be doing

• Provide technical support and troubleshoot issues related to die sort, die bond, and various manufacturing processes.
• Collaborate with production teams to optimize manufacturing processes and improve product quality.
• Conduct failure analysis and develop corrective actions to address process‑related issues.
• Design and implement process improvements to enhance efficiency and productivity.
• Maintain comprehensive documentation and records of all engineering activities.
• Participate in product validation and new product introduction activities.
• Provide training and guidance to production staff on technical procedures and best practices.

What we're looking for

• A bachelor's degree in Mechanical Engineering or a related engineering discipline.
• Minimum 3-5 years of experience in an application engineering or process engineering role, preferably in the semiconductor industry.
• Proficient in die sort, die bond, and other semiconductor manufacturing processes.
• Strong problem‑solving and analytical skills, with the ability to identify and resolve complex technical issues.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross‑functional teams.
• Familiarity with relevant industry standards, regulations, and quality management systems.

Interested applicants, please click on “Apply Now” or submit your resume to [e-mail].

We regret only shortlisted candidates will be notified.

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Trust Recruit Pte Ltd

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