Thermal Mechanical Technical Sales Leader

FINITI PARTNERS PTE. LTD.; Singapore; On-site; SGD 180,000 - 270,000; Full time

Job summary

FINITI PARTNERS PTE. LTD.

seeks an APAC Technical Sales Engineering Leader (Semiconductor Simulation) to build and lead a high‑performing team across the APAC region, driving adoption of advanced physics simulation technologies with top semiconductor customers. You will lead technical engagements, influence product strategy, and collaborate with Product, Engineering, and Commercial teams to accelerate market adoption, while representing the company in executive discussions and major industry

Qualifications

• 10–15+ years of experience in thermal management, thermo‑mechanical engineering, and physics‑based simulation within the semiconductor industry.
• Proven leadership experience managing and developing high‑performing technical teams.
• Strong background in technical sales, pre‑sales, solution engineering, or other customer‑facing technical roles.
• Demonstrated success in commercializing simulation software or engineering solutions for semiconductor customers.
• Excellent communication and stakeholder management skills, with the ability to engage both engineering teams and executive‑level customers.

Responsibilities

• Build, lead, and scale a high-performing team of simulation engineers across the APAC region to meet business growth objectives.
• Partner with leading semiconductor customers and global industry leaders to solve complex engineering challenges using advanced simulation technologies.
• Lead technical customer engagements by delivering solution demonstrations, POCs, and defining implementation strategies to drive adoption.
• Collaborate with Product, Engineering, and Commercial teams to influence the product roadmap and accelerate market adoption across Asia.
• Represent the company as a trusted technical advisor during executive customer meetings and major industry events to strengthen client relationships.
• Drive the commercialization and adoption of cutting‑edge physics simulation technology across the semiconductor industry to expand market presence.

Skills

Leadership

Technical sales

Customer facing

Communication

Job description

APAC Technical Sales Engineering Leader (Semiconductor Simulation)

Be at the forefront of next-generation physics simulation, partnering with the world's leading semiconductor companies.

Lead and grow a high-performing APAC technical sales engineering team specializing in semiconductor physics simulation. Drive customer engagements, influence product strategy, and accelerate adoption of advanced simulation technologies in the semiconductor industry.

Responsibilities

• Build, lead, and scale a high-performing team of simulation engineers across the APAC region to meet business growth objectives
• Partner with leading semiconductor customers and global industry leaders to solve complex engineering challenges using advanced simulation technologies
• Lead technical customer engagements by delivering solution demonstrations, proof‑of‑concepts (POCs), and defining implementation strategies to drive adoption
• Collaborate with Product, Engineering, and Commercial teams to influence the product roadmap and accelerate market adoption across Asia
• Represent the company as a trusted technical advisor during executive customer meetings and major industry events to strengthen client relationships
• Drive the commercialization and adoption of cutting‑edge physics simulation technology across the semiconductor industry to expand market presence

Required competencies and certifications

• 10–15+ years of experience in thermal management, thermo‑mechanical engineering, and physics‑based simulation within the semiconductor industry
• Proven leadership experience managing and developing high-performing technical teams
• Strong background in technical sales, pre‑sales, solution engineering, or other customer‑facing technical roles
• Demonstrated success in commercializing simulation software or engineering solutions for semiconductor customers
• Excellent communication and stakeholder management skills, with the ability to engage both engineering teams and executive‑level customers