TEM Automation Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

A leading semiconductor technology company in Singapore is seeking a skilled TEM Engineer to join their dynamic team. In this role, you will perform high-quality analyses using advanced techniques such as EDS and EELS, contribute to next-generation memory technology development, and collaborate with cross-functional teams. Ideal candidates should hold a Master's or PhD in relevant fields, possess strong experience in analytical methods, and demonstrate skills in automation and hardware integration.

Qualifications

• Strong expertise in analytical techniques like EDS, EELS, and 4D STEM.
• Experience in NanoMegas applications and DM scripting is a plus.
• Master's degree or PhD in relevant fields.

Responsibilities

• Perform high‑quality TEM analysis including microstructure characterization.
• Innovate solutions for atomic‑scale device characterization.
• Collaborate with teams to correlate data with device performance.

Skills

Analytical techniques (EDS, EELS, 4D STEM)

Automation skills

NanoMegas applications

Digital Micrograph scripting

Education

Master of Science in Precision Scientific Instrumentation

PhD in Electrical and Electronics Engineering

Tools

Transmission Electron Microscopes (TEM)

Focused Ion Beam (FIB)

Job description

Micron's vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage solutions, we are at the forefront of innovation, driving technological advancements that accelerate progress across industries. Our mission is to lead with integrity, innovation, and excellence, empowering our team members to craft the future of memory technology.

At Micron, you will be part of a dynamic, inclusive, and collaborative team where your contributions are valued. Our YE lab under TD (Technology Development) at Micron's Singapore site, is equipped with the most advanced Transmission Electron Microscopes (TEMs) and Focused Ion Beam (FIB) machines available. Here, you will have the opportunity to work on groundbreaking projects that push the boundaries of what’s possible in semiconductor technology.

We are seeking a dedicated and skilled TEM Engineer to join our world‑class team. You will collaborate closely with process and integration engineers, data scientists, and other TEM experts to develop and apply innovative TEM characterization methods. Your work will directly contribute to the development of next‑generation memory technologies. The applicants are expected to have strong expertise in analytical techniques like EDS, EELS, and 4D STEM. Experience in NanoMegas applications and Digital Micrograph (DM) scripting is a plus. Successful candidates for this position will be placed at the corresponding engineer level based on previous experience and education.

Key Responsibilities

• Perform high‑quality TEM analysis, including microstructure and chemical characterization using techniques such as electron diffraction, EDS, and EELS.
• Innovate and implement technical solutions for atomic‑scale device characterization, driving faster cycles of learning in semiconductor processes.
• Develop and apply advanced TEM techniques to address complex process challenges and support critical technology development projects.
• Collaborate with multi‑functional teams to correlate atomic‑scale structural and chemical data with processing, physical modeling, and device performance.
• Build and optimize DM scripts to improve data collection and processing efficiency.
• Lead technology roadmap initiatives in collaboration with instrument vendors, industry partners, and internal teams.
• Devote to the continuous improvement of lab procedures, ensuring a safe and efficient working environment.
• Facilitate smooth shift transitions by providing detailed pass down to team members.

Requirements

• Master of Science in Precision Scientific Instrumentation OR PhD in Electrical and Electronics Engineering
• Automation skillset with relevant master’s degree or PhD is required.
• Internship semiconductor or manufacturing experience in 3D printing, laser cutting and precision.
• Internship experience in embedded hardware integration, including PCB design and component assembly for responsive, reliable signal and power systems.