TCB Design Engineer – Precision Bonding Systems

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A recruitment agency is seeking a TCB Design Engineer for a role in Singapore focused on designing advanced semiconductor packaging systems. The ideal candidate will have 2–5 years of precision equipment design experience and strong knowledge of Thermocompression Bonding technology. Responsibilities include CAD modeling and ensuring mechanical designs adhere to safety and performance standards. Competitive salary based on experience.

Qualifications

• 2–5 years of direct experience in precision equipment design.
• Strong knowledge of assembly technologies such as TCB and Laser-Assisted Bonding.
• Familiarity with bonding and inspection tools such as X-ray and optical microscopy.

Responsibilities

• Design and develop mechanical modules for Thermocompression Bonders.
• Create and maintain detailed CAD models and perform tolerance analyses.
• Work closely with electrical, software, and vision teams for system-level integration.

Skills

Precision equipment design

Thermocompression Bonding (TCB)

3D CAD tools

Cross-disciplinary teamwork

Hands-on experience with HBM

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering

Tools

SolidWorks

Creo

NX

Job description

A recruitment agency is seeking a TCB Design Engineer for a role in Singapore focused on designing advanced semiconductor packaging systems. The ideal candidate will have 2–5 years of precision equipment design experience and strong knowledge of Thermocompression Bonding technology. Responsibilities include CAD modeling and ensuring mechanical designs adhere to safety and performance standards. Competitive salary based on experience.