STATS ChipPAC Trainee Program 2026

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 35,000 - 50,000; Full time

Job summary

A leading semiconductor packaging company in Singapore is seeking fresh graduates for its Trainee Program. This program spans 18-24 months and offers structured training, mentorship, and real-world exposure in various business functions. Eligible candidates should hold a Master's or PhD in relevant fields, with strong teamwork and problem-solving abilities. Join to gain comprehensive knowledge and establish a solid foundation for your professional career.

Qualifications

• Strong teamwork and problem-solving skills.
• Fields of study include Semiconductor Packaging, Chemical Engineering, Microelectronics, etc.

Responsibilities

• Participate in structured rotational assignments over 18-24 months.
• Engage in hands-on learning with industry experts through projects.
• Receive expert coaching and mentoring.

Skills

Teamwork

Problem-solving

Education

Master's or PhD credentials

Job description

STATS ChipPAC Trainee Program is designed to nurture young, high-potential graduates into future leaders and specialists. This program provides fresh graduates with structured training, mentorship, and real-world exposure to different business functions. Trainees will gain comprehensive knowledge, sharpen their technical and soft skills, and build a strong foundation for their professional journey.

1. Tailored Education Program

• A structured rotational assignment (18-24 months).
• Professional technical and corporate culture training leveraging STATS ChipPAC's global network.

2. Learning and Development Support

• Coaching: Expert coaching to enhance individual competencies.
• Mentoring: Dedicated mentoring from experienced professionals.
• Peer Learning: Knowledge sharing and teamwork-driven collaboration.
• HR Support: Systematic career development and growth opportunities.

3. Practical, Hands‑on Learning

• Collaborate with semiconductor packaging experts through domestic and international assignments.
• Gain real‑world problem‑solving experience by participating in diverse team projects.

Eligibility

• Fields of Study: Semiconductor Packaging, Chemical Engineering, IC, Materials Science, Microelectronics, Mechanical Engineering, Industrial Engineering, Optoelectronics, Physics, Electronics, and other related fields.
• Academic Requirements: Master's or PhD credentials
• Strong teamwork and problem-solving skills.