Staff/Principal Engineer - Process Development, CMP

Micron Semiconductors; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a skilled Process Development Engineer to enhance CMP processes for advanced 3D NAND technology. The ideal candidate will have over 5 years of experience in the semiconductor industry, specifically within Chemical Mechanical Planarization. You will collaborate with vendors and lead improvements in processes to achieve higher product quality and yield. Strong communication skills and the ability to drive innovative projects are essential for this role.

Qualifications

• At least 5 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.
• M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or related fields.

Responsibilities

• Develop and optimize CMP processes to improve product quality and reliability for new memory parts.
• Understand and improve process margins to meet yield goals for 3D NAND parts.
• Conduct fundamental research and evaluate hardware for advanced CMP processes.
• Manage experiments to improve process margins and assess manufacturability.
• Collaborate with vendors to develop integration processes for NAND nodes.

Skills

CMP equipment operation

Collaboration skills

Communication skills

Adaptability

Mentorship

Education

M.S./Ph.D. in relevant fields

Tools

AMAT (LKP) CMP equipment

EBARA-300X CMP equipment

Optical metrology

Profilometry

Polishing slurries

Job description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to join Advanced Node team to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Main Responsibilities:

• As a CMP Process Development Engineer, you will be primarily responsible for developing and optimizing CMP processes to improve product quality and reliability for the next generation of Micron's memory parts.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions.
• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes.
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide strategic roadmap for N+, N++ and future NAND Nodes.
• Function in a technical advisory role within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is necessary.

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems,
• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions.
• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings.

Job Requirements/Qualifications

• At least 5 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication
• M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self-driven, adaptable, and able to manage multiple projects.
• Proven ability to take calculated risks and execute novel solutions.
• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.