Staff Engineer/Principal Engineer, R&D

STATS ChipPAC; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A technology company specializing in semiconductor packaging in Singapore seeks a passionate R&D Staff Engineer/Principal Engineer. The role involves leading advanced packaging technology development for optical interconnects, collaborating with cross-functional teams, and driving new technologies from concept to production. Candidates should have at least 10 years of experience in the semiconductor industry, including hands-on expertise in optics and packaging processes. Excellent communication and project management skills are essential.

Qualifications

• Minimum of 10 years in the semiconductor industry, including 5 years in technical/project management.
• Familiar with wafer-level processing and advanced singulation.
• Strong communication, collaboration, and interpersonal skills.

Responsibilities

• Lead packaging technology development and projects with universities/research institutes.
• Collaborate to enable scalable, manufacturable designs.
• Research and create new technologies for emerging frontiers.

Skills

Optics and photonics fundamentals

Packaging and measuring fiber-coupled devices

Cross-functional teamwork

Project management

Problem-solving methodologies

Education

M.S. or Ph.D. in Physics, Materials Science, Mechanical, Chemical or Electrical Engineering

Tools

Optical component design and simulation

Test vehicles for reliability assessment

Job description

STATSChipPac is seeking a hardworking and passionate R&D Staff Engineer/Principal Engineer, with experience in Silicon Photonics advanced packaging, to realize next-generation optical interconnects for high-volume manufacturing. The candidate will join the Singapore R&D team and lead the packaging technologies development with universities and research institutes. The candidate will drive and bring Si photonics/chiplet packaging and co‑package optics development, utilizing advanced packaging technologies, to scalable production. The development covers high efficient optical I/O module architecture, assembly, optical coupling design, materials and process for fiber packaging.

The candidate will report to the Vice President of R&D. The successful candidate will have demonstrated advanced packaging technologies expertise, program management, excellent communication skills, and ability to apply process‑control and problem‑solving methodologies to achieve business objectives.

Responsibilities

• Lead packaging technology development and projects with universities/research institutes.
• Collaborate with cross‑functional teams to enable scalable, manufacturable designs – define assembly baseline processes, decide package BOM, establish design/manufacturing (e.g., optical coupling) optimized for performance, reliability, yield and cost.
• Work with customers, vendors and research institutes to bring packaging solution from concept to high‑volume manufacturing.
• Research and create new technologies for emerging frontiers.
• Drive new technologies development for timely new product introduction and ramping of new technologies.
• Support project management and technical findings documentation through reports, reviews, or relevant forum presentations.

Qualifications

• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands‑on experience in packaging and measuring fiber‑coupled devices, preferably with optical component design, simulation and qualification, and fiber assembly.
• M.S. or Ph.D. in Physics (Optics major), Materials Science, Mechanical, Chemical or Electrical Engineering or related field.
• Minimum of 10 years of experience in the semiconductor industry, including at least 5 years in technical and/or project management.
• Familiar with wafer‑level processing and packaging (e.g., CMP, TSV, CoW, advanced singulation) and interconnection assembly (e.g., hybrid bonding, CoWoS, CoPoS).
• Experience designing test vehicles for reliability and performance assessment. Capable of troubleshooting and analyzing the physics of failure.
• Strong cross‑functional teamwork, collaboration, interpersonal, written and business skills. Good communication skills.