Staff Engineer/Principal Engineer, R&D

STATS ChipPAC Pte. Ltd. (Corporate Office); Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an experienced R&D Staff Engineer/Principal Engineer specializing in silicon photonics advanced packaging. The role involves leading technology development projects, collaborating with teams, and drive new product introductions. The ideal candidate has over 10 years of experience in the semiconductor industry, with advanced packaging technologies expertise and strong communication skills.

Qualifications

• Minimum of 10 years of experience in semiconductor industry.
• Hands-on experience in optical component design and fiber assembly.
• Experience in designing test vehicle for reliability and performance assessment.

Responsibilities

• Lead packaging technology development and projects.
• Collaborate with cross-functional teams on designs.
• Research and create new technologies for emerging frontiers.

Skills

Optics and photonics fundamentals

Packaging and measuring fiber-coupled devices

Project management

Cross-functional teamwork

Education

M.S. or Ph.D. in Physics, Material Science, Mechanical, Chemical or Electrical Engineering

Tools

Optical component design software

Job description

STATSChipPac is seeking a hardworking and passionate R&D Staff Engineer/Principal Engineer, with experience in Silicon Photonics advanced packaging, to realize next-generation optical interconnects for high-volume manufacturing. The candidate will join the Singapore R&D team and lead the packaging technologies development with universities and research institutes. The candidate will drive and bring Si photonics/chiplet packaging and co-package optics development, utilizing advanced packaging technologies, to scalable production. The development covers high efficient optical I/O module architecture, assembly, optical coupling design, materials and process for fiber packaging.

The candidate will report to the Vice President of R&D. The successful candidate will have demonstrated advanced packaging technologies expertise, program management, excellent communication skills, and ability to apply process-control and problem-solving methodologies to achieve business objectives.

Responsibilities

• Responsible to lead packaging technology development and projects with universities/research institutes.
• Collaborate with cross-functional teams to enable scalable, manufacturable designs – define assembly baseline processes, decide package BOM, establish design/manufacturing (eg. optical coupling) that are optimized for performance, reliability, yield and cost.
• Work with customers, vendors and research institutes to bring packaging solution from concept to HVM.
• Research and create new technologies for emerging frontiers.
• Drive new technologies development for timely new product introduction and ramping of new technologies.
• Support project management and technical findings documentation through reports, reviews, or relevant forum presentations.

Qualifications

• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands‑on experience in packaging and measuring fiber‑coupled devices, preferably has hands‑on experience in optical component design, simulation and qualification, and fiber assembly.
• M.S. or Ph.D. in Physics (Optics major), Material Science, Mechanical, Chemical or Electrical Engineering or related field.
• Minimum of 10 years of experience in semiconductor industry, including at least 5 years of experience in technical and/or project management.
• Familiar with wafer‑level processing and packaging (such as CMP, TSV, CoW, advanced singulation) and interconnection assembly (such as hybrid bonding, CoWoS, CoPoS).
• Experience in designing test vehicle for reliability and performance assessment. Capable to troubleshoot and analyze the physics of failure.
• Strong cross‑functional teamwork, collaboration, interpersonal, written and business skills. Good communication skills.