(Sr.) Tape Out Engineer

NXP Semiconductors Singapore Pte Ltd; Singapore; In loco; SGD 120.000 - 160.000; Tempo pieno

Descrizione del lavoro

NXP Semiconductors Singapore Pte Ltd. seeks a Tape Out Engineer to oversee the final design checkpoint before IC fabrication.

You will ensure physical and logical data meet stringent manufacturing standards while liaising with design, program management, technologists, and manufacturing teams to resolve issues and drive quality outcomes. Key responsibilities include coordinating tape-out, verifying design integrity, and ensuring compliance with foundry requirements.

Competenze

• Bachelor's degree in Electrical/Computer Engineering or related field; Master’s preferred.
• Experience with physical design tools (Cadence, Synopsys) and semiconductor manufacturing workflows.
• Excellent attention to detail, problem-solving, and ability to meet tight deadlines.
• Willingness to work with flexible hours to support critical tape-outs.

Mansioni

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing discrepancies or errors.
• Collaborate with cross-functional teams to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Conoscenze

Attention to detail

Problem solving

English communication

Deadline-driven

Formazione

Bachelor's degree in Electrical/Computer Engineering

Master's degree preferred

Strumenti

Cadence

Synopsys

Manufacturing workflows

Descrizione del lavoro

Tape Out Engineer Job Description

Role Overview, Responsibilities, and Qualifications

The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

Key Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.


• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.


• Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.


• Ensure all deliverables conform to foundry requirements.


• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field (Master's preferred).


• Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.


• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.


• Willingness to work with flexible working hours to support critical Tape-outs.


• Effective communication in English for collaborating across technical teams.

This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

More information about NXP in Singapore...