Sr Engineer , Pkg Reliability

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 85,000 - 110,000; Full time

Job summary

A global semiconductor company in Singapore is seeking a Senior Package Reliability Engineer to ensure quality and reliability in semiconductor packages. Responsibilities include leading new product qualification efforts, developing reliability test plans, and engaging with customers on quality concerns. The ideal candidate has a degree in Engineering, at least 5 years of experience in Quality/Reliability Engineering, and strong problem-solving and communication skills. This position offers an opportunity to work in a dynamic, innovative environment.

Qualifications

• In-depth knowledge of semiconductor package assembly processes.
• Minimum 5 years experience in Quality/Reliability Engineering.
• Strong understanding of material interactions affecting reliability.

Responsibilities

• Lead package qualification efforts for new products.
• Develop reliability test plans to evaluate risks.
• Participate in root cause analysis and corrective actions.

Skills

Knowledge of semiconductor package assembly

Understanding of thermo-mechanical interactions

Proficiency in reliability test methods

Analytical problem-solving abilities

Project management skills

Communication skills in English

Familiarity with backend manufacturing software

Understanding of quality management tools

Education

Bachelor's or Master's in Engineering

Job description

Position Overview

As a Global Quality (GQ) Senior Package Reliability Engineer at Micron Technology Inc., you will be accountable for ensuring the quality and reliability of semiconductor packages across assigned product lines. This role encompasses end-to-end coordination of package qualification activities for new products, as well as for new designs, materials, or processes. You will provide recommendations on product release decisions based on comprehensive reliability test results.

Key Responsibilities

• New Product Qualification Leadership

  Lead and coordinate package qualification efforts for new products and process introductions.

  Develop and implement robust qualification plans for new technologies and product developments.

  Provide recommendation on new product release readiness based on reliability assessment outcomes.

• Reliability Test Planning and Execution

  Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues.

  Recommend effective screening methodologies for quality-sensitive lots.

  Maintain and improve monitoring systems to ensure ongoing package quality.

• Root Cause Analysis and Corrective Actions

  Participate and drive in 8D problem‑solving processes.

  Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs.

  Prepare and present technical reports for internal and external partners.

• Customer and Partner Engagement

  Serve as a technical liaison for both internal teams and external customers regarding package-related quality and reliability concerns.

  Evaluate customer requests for alignment with Micron’s quality policies.

  Provide technical expertise and support for customer inquiries and requirements.

Qualifications and Skills

• In-depth knowledge of semiconductor package assembly processes and surface mount technology.
• Strong understanding of thermo‑mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.
• Proficiency in industry‑standard reliability test methods, life‑prediction acceleration models, and statistical sampling.
• Strong analytical problem‑solving abilities and project management skills.
• Good written and verbal communication skills in English and digital literacy are vital.
• Familiarity with backend manufacturing software systems.
• Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).
• Self‑motivated, meticulous, and capable of independent work and multi‑cross‑functional teamwork.

Education and Experience

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.
• Minimum 5 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis (ten years preferred for senior roles).
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in‑process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in‑process materials and bulk raw materials, and recommends corrective actions when necessary. Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed. May assure compliance to in‑house and/or external specifications and standards, such as GMPs and ISO regulations. Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.