Software Engineer – Thermocompression Bonder Control Systems

Pyxis CF; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

A leading technology company in Singapore is seeking a Software Engineer to develop precision motion control software for Thermocompression Bonders. The role involves architecting real-time software and collaborating with various teams. Ideal candidates will have over 5 years of experience in motion control and proficiency in C/C++, Python, and PLC programming. This position offers a challenging work environment and opportunities for growth.

Qualifications

• 5+ years of experience in real-time motion or robotic control.
• Strong understanding of multi-axis kinematics and control loop tuning.
• Expertise in developing closed-loop PID and adaptive control algorithms.

Responsibilities

• Architect and implement real-time motion control software for precision systems.
• Develop diagnostic and calibration routines for alignment.
• Integrate temperature, displacement, and force feedback loops.

Skills

C/C++

Python

Motion control

Real-time control

Sensor feedback loops

Education

Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics

Tools

TwinCAT

Codesys

EtherCAT

RTOS

dSPACE

National Instruments CompactRIO

Job description

Software Engineer – Thermocompression Bonder Control Systems

The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.

Key Responsibilities:

• Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
• Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
• Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
• Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
• Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
• Optimize bond process cycles using advanced motion trajectories and event synchronization.
• Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.
• Implement data logging and predictive diagnostics for machine health and precision drift.

Required Qualifications:

• Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics.
• 5+ years of experience in real-time motion or robotic control.
• Expertise in C/C++, Python, and IEC 61131-3 PLC programming (TwinCAT, Codesys, or similar).
• Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
• Strong understanding of multi-axis kinematics and control loop tuning.

Preferred Qualifications:

• Experience in semiconductor assembly equipment software.
• Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
• Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.

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