Service Engineer (Semiconductor/Automatic Wire-Bonders) – Up to $6,000 + AWS

Search Personnel; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A recruitment agency is seeking a Service Engineer for the Semiconductor industry based in Singapore. The role involves providing technical support, coordinating project specifications, and assisting in pre-sales activities. Candidates should have a Diploma/Degree in Engineering and at least 3 years of relevant experience, especially with Wire-Bonders equipment. Competitive salary package including bonuses and benefits available.

Benefits

Medical & Dental Benefits

14 Days Annual Leave

Variable Bonus

Qualifications

• Minimum 3 years of experience in Wire-Bonders Equipment, Semiconductor Assembly.
• Willingness to travel occasionally in Asia Pacific region.
• In-depth knowledge of Semiconductor assembly in Wire-Bonders.

Responsibilities

• Provide technical support on project designs and proposals.
• Participate in meetings to define project specifications.
• Coordinate between Sales/Marketing and Technical Service teams.
• Assist with pre-sales activities by leading discussions and presentations.

Skills

Technical support

Analytical skills

Problem-solving

Communication

Presentation skills

Education

Diploma / Degree in Engineering

Job description

• Position : Service Engineer (Semiconductor/Automatic Wire-Bonders) – Up to $6,000 + AWS
• Location : West – Science Park Road
• Working hours : Monday to Friday | 8.30am to 5.30pm ( 1 Day WFH )
• Salary (commensurate with experience) : Salary Open For Discussion + AWS + Variable Bonus + Business Allowances + Mobile Claims + 14 Days AL + Medical & Dental Benefits + PA & H&S Insurance coverage
• Duration : Permanent
• Industry : Semiconductor

Main Responsibilities:

• Provide technical support on project designs and proposals. Use strong analytical and problem‑solving skills to address challenges, especially under tight deadlines.
• Participate in internal and external meetings to define and clarify project requirements and specifications for execution.
• Coordinate between the Sales/Marketing and Technical Service teams to align on goals and ensure customer satisfaction.
• Assist with pre‑sales activities by leading technical discussions, delivering presentations, and providing accurate cost and time estimates.

Requirements:

• Minimum Diploma / Degree in Engineering with minimum 3 years of related experiences preferably on Wire‑Bonders Equipment, Semiconductor Assembly.
• Willing to travel when required, occasionally within the Asia Pacific region.
• At least several years in‑depth knowledge & experiences within semiconductors assembly in the front‑of‑line equipment, particularly in the Wire‑Bonders (Gold/Copper/Aluminium).

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Chloe Ong

Associate Consulting Director (APAC)

Reg no.: R22105510

EA No: 13C6684