Service & Application Engineer #79534

ANRADUS PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading manufacturing company in Singapore is seeking a Service & Application Engineer to provide technical support for project designs and coordinate between teams. The ideal candidate has at least 3 years of experience with wire bonders and semiconductor assembly. This permanent role offers a competitive salary package including bonuses and requires occasional travel in Asia Pacific.

Benefits

Competitive salary package

Variable bonus

Qualifications

• 3+ years of relevant experience, preferably with wire bonders and semiconductor assembly.
• Strong technical knowledge of front-of-line assembly.
• Willingness to travel within the Asia Pacific region.

Responsibilities

• Provide technical support for project and application design proposals.
• Join internal and external meetings to define specifications for project execution.
• Coordinate between sales/marketing and technical service teams to meet customer needs.

Skills

Problem-solving

Technical support

Knowledge of semiconductor equipment

Education

Diploma or Degree in Engineering

Job description

Overview

• Industry/ Organization Type: Manufacturing (Semiconductor)
• Position Title: Service & Application Engineer
• Working Location: Science Park
• Working Hours: 5 days (Mon – Fri, 8.30am – 5.30pm)
• Salary Package: Basic salary up to $6,000 + AWS + Variable Bonus
• Duration: Permanent Role

Key Responsibilities

• Provide technical support for project and application design proposals.
• Apply analytical problem-solving skills; handle tight timelines and challenging issues.
• Join internal and external meetings to define specifications for project execution.
• Coordinate between sales/marketing and technical service teams to meet customer needs.
• Support pre-sales technical discussions and presentations; align on cost and time estimates.
• Maintain strong, hands-on knowledge of semiconductor front-of-line equipment, especially wire bonders (gold/copper/aluminium).

Qualifications

• Diploma or Degree in Engineering.
• At least 3 years of relevant experience, preferably with wire bonders and semiconductor assembly.
• Strong technical knowledge of front-of-line (FOL) assembly.
• Able to travel when required, occasionally within the Asia Pacific region.

How to Apply

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to [e-mail]. Please indicate #79534 on the email subject.

Anradus Application Policy

We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it\'s likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Rachael Lee | EA Reg No.: R2093131