Senior Thin Film PECVD Process Engineer

RF360 Singapore; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Senior CVD Process Engineer to lead process development and optimization in thin film deposition technologies. The ideal candidate will have over 5 years of experience and strong technical expertise in CVD processes. This role offers the opportunity to drive continuous improvement and innovation in semiconductor manufacturing.

Qualifications

• Minimum 5 years of hands‑on experience in CVD or related thin film deposition processes.
• Strong understanding of deposition mechanisms, vacuum systems, and plasma processes.
• Proficient in statistical and quality tools (e.g., SPC, DOE, JMP, Minitab).
• Effective communicator and team player with a strong sense of ownership.

Responsibilities

• Lead continuous improvement projects to enhance process efficiency and yield.
• Develop and optimize CVD, PECVD, PVD, ALD, and dry etching processes for thin film applications.
• Conduct root cause analysis and implement effective corrective actions.

Skills

CVD process

Thin film deposition

Statistical tools

Problem-solving

Project management

Education

Bachelor's or master's in chemical engineering, Materials Science, Physics

Tools

SPC

DOE

JMP

Minitab

Job description

Position Summary

We are seeking a highly experienced and driven Senior CVD Process Engineer to lead process development and optimization efforts in thin film deposition technologies. This role requires deep technical expertise, strong leadership capabilities, and a collaborative mindset to drive continuous improvement and innovation in semiconductor manufacturing.

Academics

• Bachelor’s or master’s in chemical engineering, Materials Science, Physics, or related field.

Experience / Any Other Special/Skill attributes

• Minimum 5 years of hands‑on experience in CVD or related thin film deposition processes.
• Strong understanding of deposition mechanisms, vacuum systems, and plasma processes.
• Experience with PECVD, CVD, PVD, ALD, and dry etching systems; knowledge of gap‑fill dielectric deposition and sputtering preferred.
• Proficient in statistical and quality tools (e.g., SPC, DOE, JMP, Minitab); familiar with cleanroom operations.
• Strong analytical, problem‑solving, and project management skills.
• Self‑driven, detail‑oriented, and able to work independently with a hands‑on approach.
• Proven technical competency and resilience under pressure.
• Effective communicator and team player with a strong sense of ownership.

Job Responsibilities

• Lead continuous improvement projects to enhance process efficiency and yield.
• Develop and optimize CVD, PECVD, PVD, ALD, and dry etching processes for thin film applications.
• Collaborate cross‑functionally to deliver scalable manufacturing and R&D solutions.
• Apply deep expertise in semiconductor thin film processes to resolve technical challenges.
• Champion process development and equipment start‑up through structured engineering experiments.
• Conduct root cause analysis and implement effective corrective actions.
• Utilize statistical tools (SPC, DOE, JMP, Minitab) for data analysis and process control.
• Ensure compliance with cleanroom, safety, and quality standards.
• Lead task forces for short‑ and long‑term process improvements.
• Demonstrate ownership, accountability, and a proactive, hands‑on approach.
• Mentor junior engineers and foster technical knowledge sharing.