Senior Thin-Film Equipment Engineer – KPI/Uptime Lead

Vanguard International Semiconductor Corporation (VIS)

Singapore

On-site

SGD 70,000 - 110,000

Full time

2 days ago

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Job summary

Vanguard International Semiconductor Corporation (VIS) in Singapore seeks an experienced Equipment Maintenance Engineer to own and improve key KPIs across quality, uptime, and cost. You will sustain equipment performance, coordinate with process and manufacturing teams, and drive a robust preventive maintenance program.

You will lead a small team, mentor staff, and document corrective actions while applying FMEA insights and SPC analysis (e.g., JMP).

Qualifications

Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering is required.
Minimum 3 years of relevant experience in wafer fabrication and handling Thin Film Equipment (CVD/PVD).
Strong interpersonal, communication and documentation skills.
High integrity with leadership abilities to lead and coach a team.

Responsibilities

Own, maintain and improve Quality, Uptime and Cost indices.
Sustain equipment KPI and drive continuous improvements to performance.
Monitor and control equipment performance indices; optimize PM procedures.
Coordinate with process and manufacturing Engineers to meet module objectives.
Manage logistics for parts to prevent downtime during equipment failures.
Control maintenance expenditure without compromising quality output.
Drive continuous improvement of equipment KPI in quality, uptime and cost.
Plan and implement an effective Preventive Maintenance program.
Coach and mentor subordinates and provide performance feedback.
Document Corrective Action and Best Known Methods for ROI and learning.
Participate in CIP programs to optimize equipment utilization and cost of maintenance.
Become the technical Expert for the respective machine specialization.
Monitor and analyze SPC charts; use JMP to analyze engineering experiments.
Know how to use measurement instruments for data collection.
Understand FMEA and generate FMEA analyses to identify top risks.
Create PROMIS DC OP and SPC charts.
Coordinate new equipment start-up to support production, from facilities hookup to acceptance.
Wafer scrap reduction awareness.
Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure; guide Junior Engineers.
Self-audit and update specifications to meet TS16949 Quality standards.
Set expectations and carry out performance appraisals for Technicians or AE as instructed.