Senior/Staff Engineer, QA, Assembly & Test, Global Quality

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading memory solutions provider seeks an experienced HBM Assembly & Test Central Snr / Staff / Principal QA Engineer in Singapore. This role ensures processes and products meet world-class quality standards and requires strong experience in semiconductor assembly/test, excellent collaboration skills, and a relevant engineering degree. Join a dynamic team dedicated to transforming information into intelligence.

Qualifications

• 5–8 years of experience in semiconductor assembly/test or quality engineering.
• Knowledge of HBM technology, advanced packaging, and JEDEC standards.
• Proficiency in statistical analysis and data visualization tools.

Responsibilities

• Validate 8D reports and ensure flawless quality assurance.
• Drive root cause analysis for quality issues.
• Perform audits to guarantee adherence to quality benchmarks.
• Review changes through the Global Change Process.
• Develop dashboards for quality metrics.

Skills

Semiconductor assembly/test

Quality engineering

Statistical analysis

Data visualization tools

Collaboration skills

Education

Bachelor’s degree in Mechanical, Electrical, Materials Engineering

Tools

JMP

Power BI

SQL

Tableau

Job description

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Join our innovative Quality Assurance team at Micron, where we value individuals who exhibit a strong dedication to transforming information into intelligence. We are seeking an experienced HBM Assembly & Test Central Snr / Staff / Principal QA Engineer to join our team in Singapore. This role plays a crucial part in ensuring our processes and products meet world-class standards and contribute to advancing our mission.

Responsibilities

• Validate 8D reports, corrective and preventive actions to ensure flawless quality assurance and governance.
• Drive containment, recovery, and root cause analysis for quality issues to successfully implement solutions.
• Perform audits and evaluations to guarantee adherence to quality benchmarks, closely monitoring Assembly & Test performance measures and reporting any discrepancies.
• Review and approve changes through the Global Change Process (GCP), ensuring change implementation accuracy.
• Develop dashboards for quality metrics using JMP, Power BI, SQL, and Tableau, demonstrating your analytical skills to pinpoint trends and areas for improvement.
• Participate in MRB events and implement defect reduction strategies to improve our continuous improvement initiatives.

Minimum Qualifications

• 5–8 years of experience in semiconductor assembly/test or quality engineering.
• Knowledge of HBM technology, advanced packaging, and JEDEC standards.
• Proficiency in statistical analysis and data visualization tools.
• Strong collaboration skills across global teams.
• Bachelor’s degree in Mechanical, Electrical, Materials Engineering, or a related field with equivalent experience.

Preferred Qualifications

• Familiarity with scripting languages (Python, VBA) for data automation.
• Experience in supplier quality management and risk assessment.
• Knowledge of reliability testing and failure analysis methodologies.
• Understanding of advanced packaging processes (e.g., TSV, hybrid bonding).
• Ability to lead cross-site projects and virtual teams effectively.