Senior/Staff Engineer, Process Integration, NTI NAND

Micron Semiconductors; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Senior/Staff NAND Module Process Integration Engineer. This role involves designing innovative process solutions for next-generation 3D NAND products. Ideal candidates will have a solid semiconductor industry background, excellent problem-solving skills, and the ability to collaborate across various teams to optimize performance and yield. A commitment to continuous improvement and technology innovation is essential.

Qualifications

• Proficiency in scripting/programming/engineering/business intelligence software is desirable.
• Minimum of 3 years of experience in semiconductor industry in Process Areas or Integration.
• Ability to understand PI modules on new NAND technologies and related mechanisms.
• In-depth knowledge of NAND and common yield issues.
• Experience in R&D and technology transfer in the Semiconductor industry.
• Committed to quality and continuous improvement.
• Self-motivated with the ability to work in dynamic environments.

Responsibilities

• Lead process modules related to 3D NAND development.
• Define structural specifications and process requirements.
• Innovate and generate patent disclosures.
• Support technology transfer from R&D to manufacturing.
• Coordinate cross-functional activities for projects.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication

Collaboration within cross-functional teams

Education

BS, MS/PhD in Electrical Engineering

Microelectronics

Chemical Engineering

Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Staff NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well‑defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model‑based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and execute device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Cross-Functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across cross-functional teams to enable a project to proceed in a rapid and low error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on‑job training and training class.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem‑solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within cross‑functional teams.

Requirements:

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the Process Areas or Process Integration.
• Ability to develop a strong holistic end‑to‑end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within Semiconductor industry
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self‑motivated, and self‑governing with proven ability to work in a demanding & dynamic environment.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field