Senior Scientist: 2.5D/3D Packaging & Bonding

Agency for Science, Technology and Research (A*STAR); Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading research organization in Singapore is looking for a passionate Scientist or Senior Scientist to advance chip-to-wafer bonding and contribute to innovative technologies in semiconductor packaging. The role requires a PhD and 5 to 10 years of relevant experience. Responsibilities include leading projects, conducting research, and collaborating with various stakeholders to develop advanced integration processes for AI and high-performance computing applications. This position offers the opportunity to make significant contributions to cutting-edge research.

Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, or related field.
• 5 to 10 years of experience in device fabrication and advanced packaging processes.
• Hands-on experience in BEOL wiring processes and hybrid bonding.

Responsibilities

• Lead internal capability development involving new materials and advanced process integration.
• Manage multi-disciplinary project teams and mentor junior colleagues.
• Conduct research into advanced bonding techniques, enhancing process capabilities.

Skills

Device fabrication

Problem-solving skills

Data analysis

Communication abilities

Education

PhD in Materials Science or related field

Tools

Hybrid bonding equipment

Job description

A leading research organization in Singapore is looking for a passionate Scientist or Senior Scientist to advance chip-to-wafer bonding and contribute to innovative technologies in semiconductor packaging. The role requires a PhD and 5 to 10 years of relevant experience. Responsibilities include leading projects, conducting research, and collaborating with various stakeholders to develop advanced integration processes for AI and high-performance computing applications. This position offers the opportunity to make significant contributions to cutting-edge research.