Senior HBM Packaging & Yield Engineering Lead

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 20,000 - 60,000; Full time

Job summary

A global leader in memory solutions seeks an experienced engineering professional in Singapore. The role involves leading package and HBM product engineering, improving yield and quality, and mentoring a high-performing team. Candidates should have a degree in Electrical/Electronic/Mechanical Engineering and strong problem-solving, statistics, and communication skills. Travel to Taiwan, the US, and Japan may be required. Join an innovative team to enhance technological advancements.

Qualifications

• Proven technical skills including root cause analysis.
• Experience with data analysis tools and scripting.
• Strong team collaboration and communication skills.

Responsibilities

• Lead initiatives to improve assembly and yield.
• Collaborate with teams to enhance engineering processes.
• Mentor and develop team members.

Skills

Problem solving

Statistics knowledge

Data analysis tools

Team collaboration

Communication skills

Education

Bachelors/Masters of Electrical/Electronic/Mechanical Engineering

Job description

A global leader in memory solutions seeks an experienced engineering professional in Singapore. The role involves leading package and HBM product engineering, improving yield and quality, and mentoring a high-performing team. Candidates should have a degree in Electrical/Electronic/Mechanical Engineering and strong problem-solving, statistics, and communication skills. Travel to Taiwan, the US, and Japan may be required. Join an innovative team to enhance technological advancements.