Senior Engineer, Product Engineering (Media Health Reliability), HIG HBM

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a reliability engineering professional to define and execute test flows for product reliability.

You will partner with the Global Quality team to set qualification plans, drive issue resolution, and lead cross-functional projects to improve yield and reliability. The role emphasizes leadership, data-driven problem solving, and collaboration across Fab, HBM, Design, and Quality/Reliability teams, with on-site Singapore work and international

Qualifications

• Bachelors/Masters in Electrical and Electronics Engineering with at least 3 years in semiconductors.
• Strong leadership and technical problem-solving abilities.
• Good knowledge of statistics and data analysis tools.
• Flexible and adaptable to different roles in a dynamic environment.
• Proven collaboration across teams to solve complex business and engineering problems.
• Excellent communication and presentation skills.
• Willing to work on site in Singapore with international travel.

Responsibilities

• Develop reliability stress, test flows and plans for product reliability.
• Define qualification plans with Global Quality and manage execution.
• Drive down DPM through optimized test flows and strategies.
• Identify root causes of Qual and RMA issues via EFA/PFA and drive improvements.
• Advise fab teams on process conversions to reduce cost and improve yield.
• Manage risks with Product Managers/Leads to balance pace and stability.
• Promote innovation and pursue AI-enabled enhancements within scope.
• Mentor and develop team members for growth.
• Develop project management skills for efficient delivery of solutions.
• Make final decisions on risk analysis and project prioritization.
• Collaborate with Fab, HBM teams, System Development and Quality/Reliability.

Skills

Leadership

Problem solving

Root cause analysis

Circuit analysis

Data analysis

Scripting

Communication

Cross-functional collaboration

Project management

Mentorship

Education

Electrical and Electronics Engineering (Bachelors/Masters)

Job description

• Reliability Test Flow Development:Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution:Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issuespertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM:The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management:The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation:The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others:The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management:Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration:This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistics development and shipping of end products.

• Contributes to a culture of continuous improvement by identifying, testing, andsharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Bachelors/Masters Electrical and Electronics Engineering Degree with 3 years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.