Senior Engineer, Advanced Packaging Integration & Yield

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an Advanced Packaging Integration Engineer to develop cutting-edge packaging technologies. This role involves improving product quality, yield, and productivity through data analysis and collaboration with various engineering teams. The ideal candidate has relevant education and experience in semiconductor processes, and strong analytical skills for innovative problem-solving.

Qualifications

• 2 or more years of semiconductor process integration experience.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis.

Responsibilities

• Develop and enable advanced package technology for assembly processes.
• Achieve and improve yields through silicon package integration innovation.
• Ensure defense coverage through process, measurement, inspection, and testing.

Skills

Proficiency in Python

Statistical analysis

Data analytics

Problem solving

Strong understanding of process flows

Education

B.S/M.S./Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering

Tools

SQL

Visual Basic

E3

FDC

RMS

Job description

A leading semiconductor company in Singapore is seeking an Advanced Packaging Integration Engineer to develop cutting-edge packaging technologies. This role involves improving product quality, yield, and productivity through data analysis and collaboration with various engineering teams. The ideal candidate has relevant education and experience in semiconductor processes, and strong analytical skills for innovative problem-solving.