Responsibilities
- Drive cost reduction, weed out unwarranted expenses/wastages, find alternative sources and improve processes with innovative solutions to raise efficiency.
- Drive quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
- Enforce on line controls and execution to conform to work instructions and procedures. Apply hands‑on and with deep involvement at work.
- Coach, guide and train engineers and technicians in processes and problem solving and analysis to build up their technical competencies and achieve self‑sustainability.
- Take accountability of work and possess strong sense of responsibility and teamwork.
- Ensure non‑conformance is dealt with in a proper and effective manner.
- Establish, review and perform regular update of FMEA, OCAP, Process control, Risk Assessment and SIPOC on all critical processes to ensure a robust process.
- Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.
Education/Experience Requirements
- Minimum Bachelor’s degree in Physics / Chemistry / Material Science / Electronic or Electrical Engineering or equivalent.
- Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance.
- Experience in high volume production of electronics components in an MNC or semiconductor industry.
- CMP Process experience on Metal and Wafer polish, experience to transfer and set up process.
- Able to lead and guide Junior Engineers.
- Able to develop new process based on process requirements.
- Good knowledge of wafer fab manufacturing processes, equipment and materials and capable of applying them effectively at work.
- Experience with Microsoft applications.