Semiconductor Process Engineer [Laser Bonding | Chip-to-Wafer / Chip-to-Substrate | Up to $8000[...]

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading HR advisory firm in Singapore is seeking a Laser-Assisted Bonder process engineer to develop, optimize, and maintain laser bonding processes. The ideal candidate holds a relevant engineering degree and has 2-5 years of experience in semiconductor packaging. Responsibilities include process development, qualification, troubleshooting, and collaborating across functions. The salary range is SGD 6000 – 8000, depending on experience. Apply now if you are passionate about high-precision applications and possess strong analytical skills.

Qualifications

• Minimum 2–5 years of experience in semiconductor packaging.
• Familiarity with laser or optical systems is necessary.
• Knowledge of bonding process behaviour under thermal/mechanical stress.

Responsibilities

• Develop and optimize laser bonding processes for product packaging.
• Qualify new laser bonding processes from R&D to production.
• Troubleshoot laser systems and bonding processes.

Skills

Experience with Laser Assisted bonding technologies

Troubleshooting

Statistical analysis

FMEA

Excellent communication

Education

Bachelor’s or Master’s degree in Materials Science

Mechanical Engineering

Electrical Engineering

Tools

X-ray analysis

JMP

Minitab

Job description

Laser-Assisted Bonder (LAB) process engineer

• Location: Sembawang
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Familiarity with advanced process control and manufacturing best practices
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

WhatsApp: https://wa.me/6591044149 (Shermaine)

Siah Sze Ming Reg No: R24125414

The Supreme HR Advisory Pte Ltd EA No: 14C7279