Semiconductor Failure Analysis Technician - Packaging

Micron Technology; Singapore; On-site; SGD 42,000 - 68,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an experienced failure analysis technician to perform electrical and physical FA on advanced packaging products.

You will prepare samples, perform cross-sectioning and polishing, and operate SEM/EDX, FIB, X-ray and C-SAM instruments to identify root causes of defects. You will document findings, write FA reports, and ensure adherence to safety, procedures, and 6S principles while contributing to continuous improvement initiatives and AI-enabled

Qualifications

• Minimum NITEC, Higher NITEC or Diploma in Engineering or equivalent.
• 1–2 years semiconductor failure analysis experience.
• Hands-on with SEM/EDX, FIB, X-ray, C-SAM and sample prep tools.
• Fundamental knowledge of semiconductor wafer fabrication and advanced packaging processes.
• Self-motivated and able to communicate with stakeholders at all levels.

Responsibilities

• Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools.
• Prepare samples, cross-section, decapsulation, polishing, microscopy inspection for FA investigations.
• Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM and other FA tools.
• Write and document FA findings and FA reports promptly.
• Ensure compliance with laboratory safety, SOPs, quality systems and 6S housekeeping.
• Participate in continuous improvement to enhance lab efficiency, analytics, and turnaround time.
• Contribute to a culture of improvement by testing and sharing AI-enabled enhancements within scope.

Skills

SEM/EDX experience

FIB

X-ray

C-SAM

Failure analysis

MS Office & report writing

Education

NITEC / Higher NITEC or Diploma in Engineering

Tools

SEM/EDX

FIB

X-ray

C-SAM

Job description

Micron Technology, Inc. in Singapore seeks an experienced failure analysis technician to perform electrical and physical FA on advanced packaging products.

You will prepare samples, perform cross-sectioning and polishing, and operate SEM/EDX, FIB, X-ray and C-SAM instruments to identify root causes of defects. You will document findings, write FA reports, and ensure adherence to safety, procedures, and 6S principles while contributing to continuous improvement initiatives and AI-enabled