Semicon R&D Process Engineer / Senior Engineer (MOLD)

People Profilers; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading technology recruitment firm in Singapore seeks a wafer-level molding process engineer to lead and develop processes for advanced packaging. The role involves optimizing and stabilizing processes for mass production. Ideal candidates should have a Bachelor's degree in Engineering and at least 3 years of relevant experience. This position requires in-depth knowledge of molding processes and a focus on continuous improvement.

Qualifications

• 3+ years’ hands-on experience in wafer-level molding process engineering.
• In-depth knowledge of molding machines and quality standards.
• Familiarity with advanced packaging and related processes.

Responsibilities

• Develop and optimize wafer-level molding and debonding processes.
• Conduct DOE, data analysis, and process improvement.
• Qualify new materials and tools for packaging.

Skills

Wafer-level molding

Process optimization

Continuous process improvement

Data analysis

Education

Bachelor's degree in Mechanical, Materials, or Electronics Engineering

Job description

Role Overview

Lead and develop wafer-level molding and related processes.

Focus is on process development, optimization, stabilization, and supporting transition to mass production.

Key Responsibilities

• Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP).
• Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement.
• Qualify new materials, tools, and equipment for packaging and device integration.
• Validate processes pre-production and stabilize yield.
• Support customer programs with technical solutions and troubleshooting.
• Review and improve FMEA, OCAP, and control plans.
• Enhance molding, debond, and wafer resizing processes.
• Drive process yield and quality improvements.
• Support technical innovation in alignment with global customer needs.

Requirements

• Bachelor's degree in Mechanical, Materials, or Electronics Engineering.
• At least 3 years’ hands-on experience in wafer-level molding process engineering.
• In-depth knowledge of molding machines, materials, procedures, and quality standards.
• Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing).

Application Process

Please email your resume in a detailed MS Word format to *****@peopleprofilers.com stating

3) Date Available

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Notes

We regret that only shortlisted candidates will be notified.