Semicon Process Engineers (grinding, laser grooving, dicing saw Chip Attach)

People Profilers; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A semiconductor packaging company in Singapore is seeking a Development Engineer to support R&D and process integration activities for wafer-level packaging technologies. The role requires experience in semiconductor packaging process development and involves optimizing Chip-on-Wafer processes, performing reliability analyses, and collaborating with cross-functional teams. A competitive remuneration package and benefits are offered.

Benefits

Competitive remuneration package

Comprehensive range of benefits

Qualifications

• Minimum 3 years of hands-on experience in semiconductor packaging process development.
• Strong knowledge of DOE, FMEA, SPC, and failure analysis methodologies.
• Experience in OSAT, Foundry, or Advanced Packaging environments is preferred.

Responsibilities

• Develop and optimize Chip-on-Wafer processes including Chip Attach.
• Perform material evaluations and reliability analyses.
• Collaborate with teams for process integration.

Skills

Chip Attach

DOE

FMEA

SPC

Data Analysis

Education

Bachelor’s degree in Materials, Electronics, Chemical, or Mechanical Engineering

Tools

XRF

Shear Test

SAM

Job description

Semicon Process Engineers (grinding, laser grooving, dicing saw Chip Attach)

The Development Engineer will support R&D and process integration activities for wafer-level packaging (WLP) technologies, focusing on Die Preparation, Chip Attach, and Molding processes.

Responsibilities

• Develop and optimize Chip-on-Wafer (CoW) processes: Chip Attach, including Thermo-Compression Bonding (TCB) and Laser Compression Bonding (LCB); Mold processes for compression or transfer molding to control warpage and protect chips
• Perform material evaluations and reliability analyses (e.g., XRF, shear test, SAM)
• Design and execute DOE and FMEA to ensure robust process control and yield improvement
• Collaborate cross-functionally with Bumping, RDL, and Failure Analysis teams for process integration
• Monitor industry trends in equipment, materials, and 2.5D/3D packaging technologies
• Support New Product Introduction (NPI) and yield ramp-up through structured problem-solving
• Prepare and maintain process documentation, including flow charts, risk assessments, and engineering reports
• Influence supplier qualification and capital equipment decisions related to 2.5D processes
• Drive production readiness and contribute directly to yield, reliability, and revenue growth

Requirements

• Bachelor’s degree or higher in Materials, Electronics, Chemical, Mechanical Engineering, or related field
• Minimum 3 years of hands-on experience in semiconductor packaging process development (Die Prep, Chip Attach, or Mold)
• Strong knowledge of DOE, FMEA, SPC, and failure analysis methodologies
• Familiarity with analytical and reliability tools such as XRF, shear test, SAM
• Excellent documentation, data analysis, and cross-functional communication skills
• Experience in OSAT, Foundry, or Advanced Packaging (2.5D/3D, HBM, Interposer) environments is preferred

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

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1. Date Available
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People Profilers Pte Ltd

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