Semicon Head of Operation

People Profilers Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A leading recruitment firm in Singapore is seeking a Head of Operations for Wafer Level Dicing. This role involves overseeing manufacturing operations, driving efficiency improvements, and leading operational performance to achieve excellence. The ideal candidate has over 20 years of experience in semiconductor manufacturing, with strong leadership skills and a commitment to operational excellence. Competitive remuneration and benefits offered.

Benefits

Competitive remuneration package

Comprehensive range of benefits

Qualifications

• 20+ years of relevant experience in semiconductor manufacturing or wafer-level packaging operations.
• Proven track record in leading large-scale manufacturing operations.
• Strong strategic and operational leadership skills.

Responsibilities

• Oversee all WLD manufacturing operations.
• Drive operational strategy and efficiency improvements.
• Manage operational budgets and cost control initiatives.
• Foster strong customer relationships.
• Champion continuous improvement and operational excellence.

Skills

Leadership

Operational Excellence

Lean Manufacturing

Six Sigma

Customer Orientation

Technical Expertise in Wafer-Level Manufacturing

Education

Bachelor’s degree in Engineering

Advanced degree preferred

Job description

Summary

The Head of Operations – Wafer Level Dicing (WLD) is responsible for overseeing all WLD manufacturing operations, ensuring excellence in quality, cost, delivery, and innovation.

Drives operational strategy, efficiency improvements, and performance excellence across manufacturing, process, and equipment functions to achieve world-class operational results and customer satisfaction.

Key Responsibilities

• Provide overall leadership and accountability for Wafer Level Dicing (WLD) Operations, including Manufacturing, Process, and Equipment functions.
• Own and drive operational performance metrics (KPIs) covering quality, cost, delivery, yield, and equipment reliability.
• Manage operational budgets, cost control, margin optimization, and efficiency improvement initiatives.
• Lead process and equipment optimization to improve throughput, yield, and manufacturing robustness.
• Develop and implement operational strategies and improvement programs to enhance production capability, capacity, and competitiveness.
• Foster strong customer relationships and ensure alignment of operations with customer requirements and business growth goals.
• Approve and manage departmental budgets, manpower plans, and capital investments.
• Champion continuous improvement, innovation, and operational excellence using Lean and Six Sigma methodologies.
• Build a high-performing organization through leadership development, coaching, and succession planning for managers and engineers.
• Collaborate closely with cross-functional teams (e.g., Quality, Planning, Engineering) to ensure smooth production flow and rapid issue resolution.
• Ensure all customer delivery commitments are met and effectively manage any manufacturing excursions or deviations.
• Lead initiatives to achieve top-tier customer satisfaction, reduce quality incidents, and strengthen process capability.
• Drive Best Known Methods (BKM) sharing and implementation across business units and functions.

Requirements

• Bachelor’s degree in Engineering or equivalent discipline; advanced degree preferred.
• Minimum 20 years of relevant experience in semiconductor manufacturing or wafer-level packaging operations.
• Proven track record in leading large-scale manufacturing operations with full accountability for cost, quality, and performance.
• Strong strategic and operational leadership, capable of translating business goals into executable operational plans.
• Deep technical expertise in wafer-level manufacturing, process integration, and equipment engineering.
• Demonstrated proficiency in Lean Manufacturing, Six Sigma, and other continuous improvement methodologies.
• Excellent customer orientation, communication, and stakeholder management skills.
• Strong people leadership with the ability to motivate, develop, and retain high-performing teams.
• Commitment to operational excellence, proactive quality management, and sustainable performance improvement.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [e-mail] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: [phone]

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 93395R86

People Profilers Pte Ltd (“People Profilers”) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (“e2i”), to extend the support of hiring beyond e2i’s resources to broaden the reach of jobseekers.

This is in partnership with the Employment and Employability Institute Pte Ltd (“e2i”).

e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilers’s PDPA and e2i’s PDPA (https://www.e2i.com.sg/pdpa/).