Research Engineer (MEMS Module Engineer), IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

A leading research organization in Singapore is seeking a candidate to support the development of MEMS devices. The role requires a diploma in relevant engineering or science fields and experience in semiconductor processes. Key responsibilities include collaborating with teams for fabrication procedures and troubleshooting equipment issues. Strong communication skills are essential for this role.

Qualifications

• Diploma or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of semiconductor or MEMS related working experience is advantageous.
• Experience in thin film deposition, etching, wet cleaning, wafer bonding or release process is desired.

Responsibilities

• Support the development of thin film deposition and other process modules for innovative MEMS devices.
• Collaborate to establish manufacturable fabrication procedures and perform basic tuning.
• Work with engineering team to identify issues and troubleshoot equipment.

Skills

Thin film deposition

Etching

Wet cleaning

Wafer bonding

Problem-solving methods

Communication skills

Education

Diploma or above in relevant engineering or science fields

Tools

DRSEM

CDSEM

HRTEM

Ellipsometry

Job description

Responsibilities

• Support the development of thin film deposition, etching, wet cleaning, wafer bonding and release process modules to enable the fabrication of innovative MEMS devices.
• Collaboration with process integration team to establish manufacturable fabrication procedures and perform basic process tuning.
• Work closely with the equipment engineering team to identify hardware issue and carry out basic troubleshooting of faulty equipment.
• Perform routine metrology measurements to monitor and ensure stable process performance.

Requirements

• Diploma or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of semiconductor or MEMS related working experience is advantageous.
• Experience in thin film deposition, etching, wet cleaning, wafer bonding or release process is desired.
• Hands‑on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem‑solving methods is desired
• Hands‑on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.