Research Engineer II (Semiconductor Fabrication (Heterogeneous Integrated Photonics))

Nanyang Technological University; Singapore; On-site; SGD 55,800 - 89,280; Full time

Job summary

National Centre for Advanced Integrated Photonics (NCAIP) at NTU invites a MSc/MEng engineer to fabricate photonic devices in a shared cleanroom, supporting semiconductor‑laser, RF‑photonics, and heterogeneous‑integration projects. You will run core processes, manage deposition and etching, and contribute to device characterization.

The role emphasizes hands‑on lithography, thin‑film deposition, and metrology, requiring proficiency in MATLAB/Python and strong teamwork in a safety‑driven

Qualifications

• Master's degree in EEE, Materials Science, Applied Physics, Optical/Photonic Engineering, or related field.

Responsibilities

• Fabricate integrated photonic devices end-to-end in shared cleanroom.
• Operate core process modules: e-beam/DUV/i-line lithography and etching.
• Perform heterogeneous integration and bonding of wafers and packages.

Skills

MATLAB

Python

Optical/Electronic Device Fabrication

Cleanroom Safety

Education

MSc/MEng in EEE/Materials Science/Applied Physics/Optical Photonics

Tools

e-beam lithography

DUV/i-line lithography

ICP‑RIE/RIE

PECVD/LPCVD/sputtering/ALD

metallization and annealing

Job description

National Centre for Advanced Integrated Photonics (NCAIP) is a Mid‑Sized Centre funded by the National Research Foundation. The key objective is to support efforts to develop new photonics technologies that can be translated to the semiconductor industry.

Key Responsibilities

• Fabricate integrated photonic devices end‑to‑end in a shared cleanroom across the group's semiconductor‑laser, RF‑photonics and heterogeneous‑integration projects, including wet cleaning, wafer cleaving/dicing and facet preparation.
• Run core process modules: e‑beam/DUV/i‑line lithography and ICP‑RIE/RIE etch; PECVD/LPCVD, sputtering, ALD and e‑beam deposition, lift‑off, metallization and annealing — with CD control under the Center Director's direction.
• Perform heterogeneous integration and bonding (plasma‑activated/adhesive/eutectic wafer‑die bonding, substrate thinning/CMP, advanced packaging).

Requirements

• Master's degree (MSc/MEng) in Electrical and Electronic Engineering (EEE), Materials Science, Applied Physics, Optical/Photonic Engineering, or a related field.
• At least 2 years of relevant hands‑on cleanroom and micro‑/nano‑fabrication experience with semiconductor, photonic or optoelectronic devices (project experience may also be considered).
• Practical experience with lithography and dry etching (e‑beam/DUV/i‑line, ICP‑RIE/RIE) including CD control, and with thin‑film deposition and metallization (PECVD/LPCVD, sputtering, ALD, e‑beam evaporation, lift‑off, annealing).
• Experience with optical/electrical device characterization and metrology (SEM, AFM, ellipsometry/reflectometry, profilometry) and yield/failure analysis.
• Proficient in MATLAB and/or Python with strong collaboration and communication skills, with a commitment to adhering to cleanroom safety regulations and standard operating procedures.

Hiring Institution: NTU