Research Engineer (Heterogeneous Integration), IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading research institute in Singapore is seeking a motivated Research Engineer to drive next-generation semiconductor packaging processes. This role offers hands-on work with cutting-edge technologies and the opportunity to contribute to high-impact projects in advanced packaging. Candidates should possess a relevant degree and have experience in process development, specifically within packaging R&D. Join a team dedicated to shaping the future of semiconductor innovation.

Qualifications

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, or related field.
• Experience in process development or packaging R&D.
• Strong track record in advanced packaging technologies is advantageous.

Responsibilities

• Lead design and development of advanced assembly processes.
• Coordinate evaluations of processes and materials.
• Collaborate with project leaders for project alignment.
• Generate engineering reports and contribute to intellectual properties.
• Engage with stakeholders to meet future demands.

Skills

Process development

Advanced packaging technologies

Collaboration with stakeholders

Technical reporting

Education

Bachelor's or Master's degree in relevant field

Job description

About Us

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME, you’ll have access to state-of-the‑art packaging equipment and be at the forefront of transformative research.

Position Overview

We are seeking a highly motivated Research Engineer to shape and advance next‑generation semiconductor packaging processes. Thisrole offers hands‑on involvement in cutting‑edge technologies and the opportunity to contribute to high‑impact projects that push the frontiers of advanced packaging.

Key Responsibilities

• Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan‑Out Wafer‑Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Work closely with project leaders to align on projectrequirements. Develop and enhance capabilities to meet evolving projectneeds.
• Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneousintegration.
• Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

Requirements

• Educational Background: Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, Electrical Engineering, or a related field.
• Experience: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage.