R&D Senior Application Engineer

HERAEUS MATERIALS SINGAPORE PTE. LTD.; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading material technology company in Singapore is seeking an experienced R&D Senior Application Engineer to support product validation activities and ensure robust performance. Key responsibilities include developing and validating non-pressure silver sinter paste, leading best practice projects, and training new engineers. Ideal candidates have at least 5 years of experience in solder and assembly materials for semiconductor applications, along with expertise in advanced process technologies. This role offers a dynamic environment and opportunities for innovation.

Qualifications

• Minimum 5 years in solder/assembly materials for semiconductor applications.
• Ability to optimize process parameters for advanced equipment.
• Strong technical support skills for internal teams and customers.

Responsibilities

• Develop and validate non-pressure silver sinter paste.
• Lead Best-Known Methodology Projects for NP sinter paste.
• Train new engineers and share knowledge across sites.

Skills

Stencil printing

Dispensing

Die attach

Flip chip bonding

Flux dipping

Reflow processes

Six Sigma methodologies

Problem-solving tools (JMP, Minitab, SPC, DOE)

Education

Bachelor's or Master's degree in Engineering

Tools

ASM DEK printer

ASM SiPlace

Besi Datacon

ESEC Die Bonder

Musashi dispensing platforms

Job description

About the Role

We are seeking a highly skilled R&D Senior Application Engineer to support validation activities across PDP, CD, and TD projects, ensuring robust product performance and reliability. This role also involves generating comprehensive engineering data to facilitate customer presentations and showcase the capabilities of new products.

Job Responsibilities

• Non-Pressure Silver Sinter Paste Development & Application Validation from PDP G2 to G5
• TIM1 Paste Application Validation for product development from PDP G2 to G5
• Lead Best-Known Methodology Projects for NP sinter paste and TIM1
• Validate NP Ag Sinter Paste CD projects from Stage B to C
• Collaborate on functional excellence projects
• Train new engineers and share knowledge across sites
• Perform preventive maintenance of equipment and manage inventory of test materials

Job Requirement

• Bachelor’s or Master’s degree in Engineering (Materials, Mechanical, Electrical & Electronics, Physics, or Chemistry preferred).
• Minimum 5 years in solder/assembly materials for semiconductor applications.
• Expertise in stencil printing, dispensing, die attach, flip chip bonding, flux dipping, and reflow processes.
• Ability to optimize process parameters for advanced equipment.
• Strong technical support skills for internal teams and customers.
• Proficiency in Six Sigma methodologies and problem-solving tools (JMP, Minitab, SPC, DOE, etc.).
• Hands‑on experience with ASM DEK printer, ASM SiPlace, Besi Datacon, ESEC Die Bonder, Musashi dispensing platforms (highly desirable).