R&D Scientist, Co-Packaged Optics - Optical Interconnects

A •STAR; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A leading research organization in Singapore seeks an experienced professional for the development of advanced optical interconnects in Co-Packaged Optics platforms. Candidates must have a Ph.D. in Engineering or Physics, and a strong background in optical interconnect modeling. Responsibilities include designing lens structures, simulating signal transmission impacts, and evaluating fiber array assemblies. Strong communication and teamwork skills are necessary. This position offers the opportunity to innovate in optical interconnects and test environments.

Qualifications

• Ph.D in Engineering or Physics required.
• Strong background in optical interconnect modeling essential.
• Understanding of passive alignment techniques for fiber-to-chip coupling needed.
• Familiarity with photonic packaging platforms and coupling interfaces important.

Responsibilities

• Develop optical interconnects for advanced Co-Packaged Optics platforms.
• Simulate impacts on optical signal transmission.
• Design lenses for optical I/Os in wafer-scale integration.
• Evaluate fiber array assemblies with CPO test vehicles.

Skills

Optical interconnect modeling

Communication skills

Teamwork

Education

Ph.D in Engineering or Physics

Tools

Microscope-based alignment

Metrology tools

Job description

A leading research organization in Singapore seeks an experienced professional for the development of advanced optical interconnects in Co-Packaged Optics platforms. Candidates must have a Ph.D. in Engineering or Physics, and a strong background in optical interconnect modeling. Responsibilities include designing lens structures, simulating signal transmission impacts, and evaluating fiber array assemblies. Strong communication and teamwork skills are necessary. This position offers the opportunity to innovate in optical interconnects and test environments.