R&D Process Development Engineer

United Test And Assembly Center Limited (UTAC); Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading semiconductor assembly company in Singapore is seeking an experienced engineer to focus on root cause analysis and process improvement. The successful candidate will coordinate engineering builds, engage in failure analysis, and drive project success through effective communication. A Bachelor's degree in a relevant engineering field and at least five years of experience in a high-volume electronics manufacturing environment are essential. Familiarity with process machinery and data analysis tools will be advantageous.

Qualifications

• Must have 5+ years of experience in assembly FOL/ EOL processes.
• Hands-on experience with SMT, underfill, and related processes is required.
• Familiarity with data analysis tools like JMP is necessary.

Responsibilities

• Conduct root cause analysis and problem solving.
• Implement process and machine improvements.
• Coordinate customer engineering builds and qualification builds.
• Monitor and track project progress against Key Milestones.

Skills

Root cause analysis

Problem solving

Process improvement

Project management

Data analysis

Education

Bachelor's degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline

Tools

JMP

SMT/ Flux Clean

Flip Chip/ TCB

Underfill

Lid Attach/ Laser Mark

Ball Mount/ AOI

Job description

Job Description

• Expertise in root cause analysis and problem solving
• Process / machine improvement and implementation of specific process
• Customer engineering builds
• DOE activities and report submission & presentation
• Failure analysis and root cause investigation, report preparation & presentation
• Work with third party and identify solutions to enhance capabilities
• Coordinate all customers’ engineering builds and qualification builds with relevant factory teams to maximize our resources
• Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers
• Set & monitor the KPI for the team base on underfill development projects

Requirement

• Bachelor's degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline
• Experience in high volume electronics manufacturing environment preferably semiconductor or module assembly
• Must be familiar and have hands‑on experience with either one of the following process and machines
  • SMT/ Flux Clean
  • Flip Chip/ TCB
  • Underfill
  • Lid Attach/ Laser Mark
  • Ball Mount/ AOI
• Familiar with JMP data analysis capability
• Knowledge and experience on multiple process of the above will be an advantage
• Proven experience in assembly FOL/ EOL process (at least 5 years' experience)