R&D Engineer, Advanced Packaging (2.5D/3DIC Platform)

AlwaysHired; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an R&D Engineer to drive platform development in 2.5D and 3DIC technologies. You will lead new process verification, collaborate cross-functionally, and engage with customers for performance reviews. The ideal candidate should have a Bachelor's degree in Microelectronics or a related field, with a minimum of 7 years of experience in semiconductor R&D. A hands-on approach with a passion for technology is essential. Competitive salary and benefits offered.

Qualifications

• Minimum 7 years of experience in semiconductor R&D or foundry.
• Experience focusing on integration, process, or device engineering.
• Knowledge in control plan design and structured problem-solving.

Responsibilities

• Drive 2.5D and 3DIC platform development and innovation.
• Lead new process verification for production readiness.
• Engage with customers for product verification and performance review.

Skills

Strong knowledge of semiconductor device physics

Proficient in FMEA

Excellent communication skills

Hands-on experience with 2.5D/3DIC process

Proactive and motivated

Education

Bachelor’s degree in Microelectronics or related discipline

Job description

R&D Engineer, Advanced Packaging (2.5D/3DIC Platform)

Drive 2.5D and 3DIC platform development, including new unit module and device innovation.

Lead new process verification and qualification to ensure production readiness and performance stability.

Support DSM platform setup and collaborate cross-functionally to establish process flow and integration standards.

Engage with customers for new product verification, performance review, and process optimization.

Work closely with internal teams to define process control plans, FMEA, and DOE for continuous improvement and issue resolution.

Requirements

Bachelor’s degree or above in Microelectronics, Electrical/Electronic Engineering, Physics, Materials Engineering, or a related discipline.

Minimum 7 years of experience in semiconductor R&D or foundry environment, with focus on integration, process, or device engineering.

Strong knowledge of semiconductor device physics, process integration, and device characterization.

Hands‑on experience with 2.5D/3DIC process or device development is a strong advantage.

Proficient in FMEA, DOE, control plan design, and structured problem‑solving methodologies.

Highly motivated, proactive, and an effective communicator with a passion for technology innovation.

Interested candidates please apply online or send your latest CV to *********@AlwaysHired.com.sg

AlwaysHired Pte Ltd

EA: 24C2293