Product Integration Lead, HIG High Bandwidth Memory

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A leading technology company in Singapore is seeking a Product Integration Lead to integrate cutting-edge HBM products with end-system requirements. You will collaborate across multiple teams, manage technical inputs, and guide product priorities. The ideal candidate has over 10 years of experience in engineering, strong communication skills, and a desire to advance knowledge in HBM development.

Qualifications

• 10+ years of experience in Product, Design, Yield Enhancement, or related engineering fields.
• Experience with product development projects is a plus.
• Desire to develop knowledge in HBM to System development.

Responsibilities

• Manage technical inputs for silicon-system alignment.
• Collaborate with various teams to address HBM and system requirements.
• Lead Triage Team for System or Chip Feature Interaction.

Skills

Technical issue resolution

Collaborative approach

Communication skills

Interpersonal skills

Education

Bachelor’s or Master’s Degree in Electrical or Computer Engineering

Job description

Our vision is to transform how the world uses information to enrich life forall. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Integration Lead in the HIG HBM Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge HBM products into end-system requirements. You will be the key representative driving HBM development swimlane requirements (SCD) to meet end-systems needs. With a deep understanding of both HBM and System capabilities, you will set Product Development priorities and manage new change initiative requests to meet rapidly evolving customer demans with agility. You will drive resolution of technical challenges in the development cycle, identifying opportunities to ensure HBM solutions are executed within the boundary of development schedule, risks and incremental development costs.

Key Responsibilities include, but are not limited to:

• Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).
• Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements.
• Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues.
• Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders.
• Manage Qualification Definition and Changes, driving the Change Control Board for Late/Post Qual Changes.
• Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams.

Key Requirements:

• Bachelor’s Degree or Master’s Degree in Electrical or Computer Engineering.
• 10+ years of demonstrated ability in Product, Design, Yield Enhancement, or related engineering fields. Experience with product development projects is a plus.
• Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach.
• Desire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial.
• Excellent interpersonal, communication and presentation skills to gather technical information from engineering key stakeholders and drive technical issue resolution/mitigation.