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A semiconductor solutions provider in Singapore is looking for a Process Engineer to develop advanced packaging technologies for high-density electronic devices. Responsibilities include collaboration with customers and R&D teams, providing technical support, and innovating new processes. No prior experience is required, though candidates with hands-on semiconductor assembly experience will be preferred, along with familiarity in analytical and simulation tools.
[Order Number: 1055551-R]
Overview: Develop advanced packaging technologies and processes for assembling high-density, high-performance electronic devices. Work closely with external customers and partners to provide technical support and drive joint development. Collaborate with internal R&D and product teams to create new processes and products.
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