Process Engineer – Lithography & PVD Excellence

United Test And Assembly Center Limited (UTAC); Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

UTAC Singapore is seeking a Process Engineer to own documentation and drive improvements across PMFEA, OCAP and WI/SOP. You will troubleshoot rapid issues, plan new process/package developments, and lead CIP initiatives to resolve chronic problems.

The role requires 3+ years in semiconductor manufacturing with exposure to dry or wet processes, strong SPC, and proficiency in Excel/PowerPoint. Collaboration with cross-functional teams is essential for successful implementations.

Qualifications

• Requires degree in Engineering or Science or related field.
• Minimum 3 years in semiconductor manufacturing, exposure to dry (photolithography/plasma, sputtering) or wet processes (electrochemical plating, etching).
• Strong SPC and problem-solving skills.
• Proficient in MS Excel and PowerPoint; CAD or statistical software experience a plus.
• Strong analytical, documentation, and communication skills.

Responsibilities

• Respond quickly to process or quality issues in assigned module and troubleshoot effectively.
• Owner of PMFEA, OCAP and WI/SOP for documentation and update.
• Propose and lead process CIPs for chronic issue resolving.
• Plan and execute new process/package development and evaluations.
• Perform process margin study to determine the process capability of new process/ package.
• Lead evaluation lots and report the results in a timely manner.
• Provide technical training and support for troubleshooting process issues.
• Collaborate with cross-functional teams to ensure smooth implementation of new processes/packages.

Skills

SPC

Problem-solving

Analytical thinking

Communication skills

Documentation

MS Excel

PowerPoint

CAD

JMP

Minitab

Education

Engineering or Science degree

Tools

CAD software

JMP

Minitab

Job description

UTAC Singapore is seeking a Process Engineer to own documentation and drive improvements across PMFEA, OCAP and WI/SOP. You will troubleshoot rapid issues, plan new process/package developments, and lead CIP initiatives to resolve chronic problems.

The role requires 3+ years in semiconductor manufacturing with exposure to dry or wet processes, strong SPC, and proficiency in Excel/PowerPoint. Collaboration with cross-functional teams is essential for successful implementations.