Process Director - Wafer Process (Semicon)

People Profilers; Singapore; On-site; SGD 120,000 - 150,000; Full time

Job summary

A leading recruitment firm in Singapore is looking for a Process Director to lead engineering activities in wafer fabrication. Ideal candidates will have over 15 years of experience and at least 5 years in a management role. Responsibilities include driving manufacturing processes and ensuring quality improvements. A competitive remuneration package and comprehensive benefits are offered.

Qualifications

• Minimum of 15 years engineering experience in wafer fab or wafer bumping house.
• At least 5 years management experience at Director/Deputy Director level.
• Thorough knowledge of wafer level packaging.

Responsibilities

• Plan and direct all aspects of engineering activities.
• Drive team for continuous improvement in cost, yield and quality.
• Understand customer requirements and meet/exceed customer goals.
• Drive engineering discipline in cost, yield and quality improvement.
• Arrange training for Process Managers and Engineers.

Skills

Engineering discipline

Statistical Process Engineering

Continuous improvement

Wafer level packaging knowledge

Education

Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry

Tools

FDC

SPC

Job description

Process Director - Wafer Process (Semicon)

Plan and direct all aspects of engineering activities

Drive team for continuous improvement in cost, yield and quality

Responsible for setting up department KPIs

Job :

Understand customer requirements and meet/exceed customer goals

Drive team to set up stable manufacturing processes with CpK >1.67

Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield and quality improvement

Arrange training for Process Managers and Engineers.

Deploy FDC and SPC on key equipment

Partnership with cross functional teams to meet production schedules, quality and safety

Customer engineering and issues resolution

Requirement

Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level in a fast moving environment

Thorough knowledge of wafer level packaging, engineering and production

Have experience in setting up FDC and SPC

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Kindly email your resume in a detailed Word format to *************@peopleprofilers.com

People Profilers Pte Ltd

20 Cecil Street, #08-09, Plus Building, Singapore 049705
EA Licence Number: 02C4944
EA Registration Number: R22109328
EA Personnel: Franzizca Mah