Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.
Your responsibilities will include, but are not limited to, the following:
- Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
- Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility
- Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams
- Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing
Successful candidates for this position will have:
- Passion for semiconductor technology and innovation
- Adept at data analysis, problem-solving, and process integration optimization
- Excellent communication skills and ability to work in cross-functional teams
Requirements:
- Minimum 2 years of experience in the semiconductor industry
- Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable
- Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms
- In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable
- Experience in semiconductor R&D product life cycle from design to manufacturing is desirable
- Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
- Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus
Education
BS, MS/PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.