Principal Engineer, Wafer-Level Packaging & APTD Tech

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A global semiconductor company in Singapore seeks a qualified individual to develop and enable processes in semiconductor manufacturing. The candidate will be responsible for improving processes, evaluating new technologies, and collaborating with various teams. Ideal candidates should have an advanced degree and experience in semiconductor processes, with strong skills in data analytics, including Python and R. Join the team to innovate in high-performance memory products.

Qualifications

• 2 or more years of semiconductor process development experience.
• Familiarity with wafer bonding and packaging fields.
• Experience with processes that affect yield & reliability.

Responsibilities

• Develop processes for post-fab wafer finishing.
• Establish and improve wafer level process conditions.
• Collaborate with teams for seamless product transfer to production.

Skills

Proficiency in Python

Proficiency in R

Proficiency in SQL

Experience with Visual Basic

Strong data analytics capabilities

Strong understanding of process flows

Education

B.S/M.S./Ph.D. in relevant fields

Tools

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

A global semiconductor company in Singapore seeks a qualified individual to develop and enable processes in semiconductor manufacturing. The candidate will be responsible for improving processes, evaluating new technologies, and collaborating with various teams. Ideal candidates should have an advanced degree and experience in semiconductor processes, with strong skills in data analytics, including Python and R. Join the team to innovate in high-performance memory products.