Principal Engineer Advanced Package Technology Development

Micron Technology, Inc.; Singapore; On-site; SGD 230,000 - 307,000; Full time

Benefits offered by this job

Healthcare

Paid time off

Retirement savings plans

Tuition Reimbursement

Professional development training

Workplace wellness programs

Job summary

Micron Technology, Inc. is seeking an experienced Principal Engineer for the Advanced Package Technology Development team at our Boise campus. You will influence solutions aligned with company goals, contribute to revenue growth, and lead cross-disciplinary teams in developing next-generation packaging technologies.

Responsibilities include driving technology roadmaps, collaborating with internal/external partners, and mentoring teams to deliver high-impact innovations in memory packaging.

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and 3D integration strategies including Hybrid bonding.
• Hands-on experience in Wafer Level Packaging or 3D stacking processes.
• Experience in DRAM manufacturing and OSAT companies.

Responsibilities

• Deliver high-value, differentiated technology solutions by driving technical innovation.
• Collaborate with partners to ensure seamless technology integration.
• Lead multi-disciplinary teams to achieve strategic goals.
• Guide development of packaging technology roadmaps and cost-reduction initiatives.

Skills

Advanced packaging engineering

HBM / 2.5D / 3D integration

Wafer Level Packaging

DRAM processing knowledge

Cross-functional collaboration

Technical leadership

Education

Ph.D. in Materials Science / Electrical / Mechanical Engineering

MS in related engineering field

Tools

Process modules

Data analysis / patent development

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Summary: Introduction

As a Principal Engineer in the Advanced Package Technology Development team at Micron, you will join a dynamic group focused on innovation and collaboration. This role lets you influence solutions that align with company goals. It contributes to increased revenue and strategic successes. You will work at our Boise campus and help develop leading technology in the industry.

Responsibilities and Duties include, but not limited to:

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
• Maintain effective communication with collaborators.
• Analyze and understand competitive trends to improve Micron’s competitive edge.
• Participate actively in technology events, contributing to industry knowledge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Demonstrate profound technical expertise to develop new technologies and guide others.
• Build an extensive technical network across various domains.
• Troubleshoot advanced issues, providing mentorship for resolution.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.
• Engage in and promote ongoing cost reduction and quality improvement initiatives.

Qualifications and Skills:

• Over 5 years of professional experience in semiconductor advanced packaging.
• BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required).
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required).
• Experience in DRAM manufacturing and OSAT companies (Required).
• Understanding of DRAM wafer structure and process flows (Highly Preferred).
• A passion for innovation demonstrated by patent inventions or published literature!

About Us

About Us As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that transforms how the world uses information. Through our global brands — Micron, Crucial, and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR, and 3D XPoint™ memory. Our solutions unlock financial insights, accelerate scientific breakthroughs, and improve communication worldwide.

Benefits

• Employee Rewards Program
• Healthcare
• Paid time off
• Retirement savings plans
• Paid parental leave
• Employee Assistance Program
• Professional development training
• Workplace wellness programs
• Micron Health Clinic (Boise only)
• Fitness Center/Activity rooms (Boise only)
• Tuition Reimbursement
• Micron Corporate Discounts
• Casual Dress attire

About Micron Technology, Inc.

About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.