Physical Failure Analysis Engineer

Wintech Nano-Technology Services Pte Ltd; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading nano-technology firm in Singapore is looking for a detail-oriented Physical Failure Analysis (PFA) Engineer to support laboratory operations focused on semiconductor analysis. This role requires expertise in advanced analysis techniques such as FIB, SEM, and EBSD. Candidates should have a degree in engineering and a solid understanding of semiconductor physics. The position offers a competitive salary of $4,000 to $6,000 monthly, along with attractive shift allowances for night rotations. Fresh graduates are welcome for the engineer level.

Benefits

Competitive monthly salary

Shift allowance for night rotations

Qualifications

• Diploma, Bachelor’s, or Master’s in Engineering (Electrical/Electronic, Materials Science).
• Hands-on experience with FIB, SEM, and EDX is desirable.
• Knowledge of EBSD analysis and data interpretation is an advantage.

Responsibilities

• Perform high-precision physical failure analysis using FIB, SEM, and EBSD techniques.
• Analyze grain orientation using EBSD for root-cause investigations.
• Prepare high-quality TEM lamella using FIB lift-out techniques.
• Compile comprehensive analytical reports for clients.
• Document and update SOPs for failure analysis workflows.

Skills

Hands-on experience with FIB

Hands-on experience with SEM

Knowledge of EBSD analysis

Understanding of semiconductor device physics

Ability to work independently

Education

Diploma in Engineering

Bachelor’s Degree in Engineering

Master’s Degree in Engineering

Tools

FIB

SEM

EDX

EBSD

Job description

Role Overview

We are seeking a detail-oriented and technically skilled Physical Failure Analysis (PFA) Engineer (or Senior Engineer) to join our team. This role is central to our laboratory operations, focusing on advanced micro-structural analysis and sample preparation to support the semiconductor and electronics industries.

Key Responsibilities

• Advanced Analysis: Perform high-precision physical failure analysis using FIB (Focused Ion Beam), SEM, and EBSD (Electron Backscatter Diffraction) techniques.
• Crystallographic Characterization: Utilize EBSD to analyze grain orientation, texture, and phase identification to support root-cause failure investigations.
• Sample Preparation: Prepare high-quality TEM (Transmission Electron Microscopy) lamella using specialized FIB-related lift-out techniques.
• Reporting: Compile comprehensive analytical reports detailing FIB-SEM, SEM-EDS and EBSD findings for client delivery.
• Standardization: Document and update Standard Operating Procedures (SOPs), training modules, and certification specifications for failure analysis workflows.
• Innovation: Participate in the research and development of new failure analysis techniques and evaluate emerging technologies to maintain lab excellence.
• Shift Operations: Work within a rotational shift system (Quarterly Day/Night shift rotation).

Requirements

• Education: Diploma, Bachelor’s Degree, or Master’s Degree in Engineering (Electrical/Electronic, Materials Science, or a related discipline).
• Technical Skills: Hands-on experience with FIB, SEM, and EDX is highly desirable.
• Prior experience or theoretical knowledge of EBSD analysis and data interpretation is a significant advantage.
• Industry Knowledge: A solid understanding of semiconductor device physics and manufacturing processes.
• Soft Skills: A keen learner with the ability to work independently in a fast-paced laboratory environment.
• Flexibility: Must be able to perform night shift work with flexible working periods.
• Experience Level: Open to Fresh Graduates for the Engineer level; experienced candidates will be considered for the Senior Engineer role.

Benefits

• Competitive monthly salary ($4,000 – $6,000).
• Highly attractive shift allowance provided for night shift rotations.