Member of Technical Staff/ Engineer, QA (Process Quality Control)

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A semiconductor manufacturing firm in Singapore is looking for a Member of Technical Staff (MTS)/Engineer, QA to develop inspection procedures. The role involves leading inspections and driving yield improvement while ensuring quality in backend semiconductor packaging processes. Candidates should possess a Bachelor's Degree in Engineering and have at least 5 years of experience. The position offers an opportunity to work in a fast-paced environment focusing on continuous improvement and collaboration.

Qualifications

• Minimum 5 years of relevant experience in backend semiconductor packaging processes and quality control.
• Strong foundation in process engineering, yield improvement, and quality control.
• Familiarity with FMEA, Control Plans, and OSAT backend processes.

Responsibilities

• Lead PQC engineers and inspectors in performing yield and product gating checks.
• Develop or enhance procedures and work instructions related to backend PQC processes.
• Drive and facilitate meetings to mitigate yield loss and create action roadmaps.

Skills

Process engineering

Yield improvement

Quality control

Data analysis

Effective communication

Education

Bachelor’s Degree in Engineering

Tools

SPC

FMEA

Control Plans

Job description

Position Summary

The Member of Technical Staff (MTS)/ Engineer, QA (Process Quality Control) is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Responsibilities

• Lead PQC engineers and inspectors in performing yield and product gating checks, ensuring alignment with production goals and driving performance improvement.
• Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.
• Develop or enhance procedures and work instructions related to backend PQC processes.
• Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.
• Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders for alignment, action, and strategic decision-making.
• Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.
• Identify chronic process and quality issues and implement permanent corrective actions.
• Responsible for new product process development and supporting smooth pilot-to-high volume transitions.
• Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.
• Ensure the relevance and accuracy of Work Instructions, Control Plans, FMEA, and other process control documents.
• Ensure audit readiness for internal and external audits and manage timely closure of findings.
• Any other ad-hoc duties as assigned.

Requirements

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).
• Minimum 5 years of relevant experience in backend semiconductor packaging processes and quality control.
• Strong foundation in process engineering, yield improvement, and quality control.
• Proficient in SPC and data analysis tools.
• Familiarity with FMEA, Control Plans, and OSAT backend processes.
• Hands‑on experience with new product and process evaluations.
• Effective communicator; capable of presenting data and driving cross-team collaboration.
• Able to thrive in a fast‑paced, high‑volume manufacturing environment.